The necessity of DPA analysis and product testing of electronic components

Date：2022-09-05 15:27:30 Views：1161

It is necessary for manufacturers to ensure the safety and reliability of each component produced. With the higher and higher quality requirements of electronic products, inevitable defects will appear in the processing process. At this time, it is necessary to carry out various tests on the produced components. The quality of electronic products also plays a vital role in the development of the industry and social stability. The following is a brief analysis of the importance of DPA analysis and detection of electronic components for your reference.

DPA (destructive physical analysis) is the whole process of sampling, dissecting, and performing a series of inspections and analyses before and after dissection according to the production batch of components in order to verify whether the design, structure, material and manufacturing quality of components meet the requirements of intended use or relevant specifications. It can determine whether it is possible to produce quality problems of component batches that endanger the use and lead to serious consequences. DPA technology is widely used in military and civilian electronic components, which is of great significance in procurement inspection, incoming inspection and quality monitoring in the production process.

Relevant statistics show that the failure of electronic system is caused by the quality of electronic components, accounting for 60%. The quality problems of electronic components mainly include: coating peeling, corrosion, glass insulator crack, bond point defect, bond wire damage, aluminum erosion, chip bonding cavity, chip defect, chip contamination, passivation layer defect, chip metallization defect, existence of superfluous objects, laser resistance modulation defect, cladding layer crack, lead false soldering, Damaged leads, insufficient solder and poor adhesion of solder joints, ceramic cracks, open circuit of electrical connection of conductive adhesive, etc. can cause failure of components, and these failures come from defects in design and manufacturing of components. Under the action of certain external factors, they will cause quality problems of the system, which seriously affect the reliability of the whole system.

Unlike quality consistency inspection and post inspection of failure analysis, DPA analysis technology aims to find defects in the design and production process. It can be widely used in both the production process and the evaluation of the quality level of components, especially in the monitoring of the production process. It plays an irreplaceable role in improving the reliability level of components.

The main functions of DPA testing are reflected in four aspects: 1. To prevent failure, prevent components with obvious or potential defects from being used on the machine. 2. Determine the deviations and process defects of components in the design and manufacturing process. 3. Inspect and verify the quality of the supplier's components. 4. Put forward batch processing opinions and improvement measures.

Generally speaking, the more the number of components used in electronic appliances, the more obvious the reliability problem will be. In order to ensure the reliable operation of products or systems, the demand for the reliability of components is particularly high and strict. Secondly, the use environment of electronic products is increasingly strict. In the process of transportation and use, electrical and electronic products may be showered by natural precipitation, and water droplets falling due to condensation and leakage may be similar to water washing caused by heavy rain, sprinkler system, etc., and may even be flooded by water. From the laboratory to the outdoor, from the tropical zone to the cold zone, from the land to the seabed, and from the high altitude to the space, they are subject to different environmental conditions. In addition to the interference of environmental temperature and humidity, the interference of sea water, salt mist, impact, vibration, cosmic particles, various radiation and other electronic components increases the possibility of product failure.

The above is the related content of DPA analysis of components compiled by Chuangxin testing. I hope it will be helpful to you. Reliability has become an important quality index of products to be assessed and tested. In a sense, reliability can comprehensively reflect the quality of products. Our company has a team of professional engineers and industry elites, and has three standardized laboratories with an area of more than 1800 square meters. It can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, function testing, factory incoming material inspection and tape weaving.