Weixin Service
DouYin
KuaiShou
SERVICE
-
IC Counterfeit Test
IC(Integrated Circuit) refers to a chip made of a large number of microelectronic components (such as transistors, resistors, capacitors, diodes, etc.) Integrated Integrated circuits on a plastic substrate. The concept of IC chip broadly speaking, is the semiconductor components products collectively.
LEARN MORE
-
Electrical and Temperature Testing
Key function testing is also called main function testing. Refers to various necessary logic or signal state tests carried out under specific working conditions (i.e. the normal operating environment of the device, usually at room temperature) and the normal working state of the device. This test according to the original factory specifications and industry standards or specifications, design feasibility test vector or special test circuit, exert the corresponding signal input on test samples, through regulation and control of the peripheral circuit, signal amplification or conversion matching specific criteria, such as analysis of the logical relation and the change of the output waveform signal status, the features of detection device.
LEARN MORE
-
Failure analysis
Through professional failure analysis equipment, with the help of a variety of test analysis technology and analysis procedures to identify the failure of electronic components, identify the failure mode and failure mechanism, confirm the final cause of failure, and put forward suggestions to improve the design and manufacturing process, to prevent the recurrence of failure.
LEARN MORE
-
Rohs test
According to the EU standard requirements, the product split into a single material is uniform material after testing, including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE) and other six kinds of harmful substances are in line with the RoHS directive requirements, the maximum order standard: cadmium: 0.01% (100PPM); Lead, mercury, hexavalent chromium, polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE)0.01% (1000PM)
LEARN MORE
-
External Visual
InspectionAppearance testing refers to confirming the number of chips received, inner packaging, humidity indication, desiccant requirements and appropriate outer packaging. Secondly, the appearance of a single chip is tested, mainly including the typing, year, country of origin, whether the chip is re-coated, the state of the pins, whether there are re-polished marks, unknown residues, and the location of the manufacturer's logo.
LEARN MORE
-
Acetone Test
Acetone test is to wipe the screen print on the front surface of the chip regularly with a certain concentration of acetone, and the result is used to judge whether the chip surface is reprinted.
LEARN MORE
-
X-Ray Inspection
X-Ray testing is a real-time non-destructive analysis to examine the hardware components inside the component. It mainly checks the chip pin frame, wafer size, gold wire binding pattern, ESD damage and holes. Customers can provide good products for comparison inspection.
LEARN MORE
-
More
LEARN MORE
CASES
ADVANTAGES
Excellent Technical Team
Standard Management System
Rich Testing Experience
NEWS
Record breaking financial report, unprecedented expansion of production: The global production capacity game behind TSMC's third quarter report
On October 15th, TSMC officially released its financial report for the third quarter of 2026: consolidated revenue of NT $1494.24 billion, net profit after tax of NT $763.06 billion, and earnings per share of NT $29.43 billion. These three indicators simultaneously broke historical records, marking the sixth consecutive quarter in which the company has rewritten its quarterly profit peak. In US dollars, the third quarter revenue was $46.72 billion, a year-on-year increase of 41.2% and a month on month increase of 16.2%, significantly exceeding the previous financial forecast range of $44.6 billion to $45.8 billion. As the global debate over the sustainability of capital expenditures on artificial intelligence continues to heat up, this report from the top of the industry chain provides a rare "hard data" validation for the entire narrative of AI computing power.
READ
