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SERVICE
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IC Counterfeit Test
IC(Integrated Circuit) refers to a chip made of a large number of microelectronic components (such as transistors, resistors, capacitors, diodes, etc.) Integrated Integrated circuits on a plastic substrate. The concept of IC chip broadly speaking, is the semiconductor components products collectively.
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Electrical and Temperature Testing
Key function testing is also called main function testing. Refers to various necessary logic or signal state tests carried out under specific working conditions (i.e. the normal operating environment of the device, usually at room temperature) and the normal working state of the device. This test according to the original factory specifications and industry standards or specifications, design feasibility test vector or special test circuit, exert the corresponding signal input on test samples, through regulation and control of the peripheral circuit, signal amplification or conversion matching specific criteria, such as analysis of the logical relation and the change of the output waveform signal status, the features of detection device.
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Failure analysis
Through professional failure analysis equipment, with the help of a variety of test analysis technology and analysis procedures to identify the failure of electronic components, identify the failure mode and failure mechanism, confirm the final cause of failure, and put forward suggestions to improve the design and manufacturing process, to prevent the recurrence of failure.
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Rohs test
According to the EU standard requirements, the product split into a single material is uniform material after testing, including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE) and other six kinds of harmful substances are in line with the RoHS directive requirements, the maximum order standard: cadmium: 0.01% (100PPM); Lead, mercury, hexavalent chromium, polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE)0.01% (1000PM)
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External Visual
InspectionAppearance testing refers to confirming the number of chips received, inner packaging, humidity indication, desiccant requirements and appropriate outer packaging. Secondly, the appearance of a single chip is tested, mainly including the typing, year, country of origin, whether the chip is re-coated, the state of the pins, whether there are re-polished marks, unknown residues, and the location of the manufacturer's logo.
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Acetone Test
Acetone test is to wipe the screen print on the front surface of the chip regularly with a certain concentration of acetone, and the result is used to judge whether the chip surface is reprinted.
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X-Ray Inspection
X-Ray testing is a real-time non-destructive analysis to examine the hardware components inside the component. It mainly checks the chip pin frame, wafer size, gold wire binding pattern, ESD damage and holes. Customers can provide good products for comparison inspection.
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CASES
ADVANTAGES
Excellent Technical Team
Standard Management System
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NEWS
Domestic fiber optic global explosion: AI computing power ignites demand, optoelectronic components usher in an upward cycle
Recently, domestic fiber optic cables have experienced a global trend of "explosive orders", becoming a major highlight in the construction of computing infrastructure in the AI era. According to industry data, in the first quarter of this year, domestic fiber optic production and sales increased by over 35% year-on-year, overseas sales growth exceeded 55%, and mainstream product prices rose by as much as 650%. The top domestic enterprises have placed orders in hand until the first quarter of next year, and their products are exported to more than 100 countries and regions. With the advantage of the entire industry chain, China's fiber optic industry has occupied more than 60% of the global production capacity, becoming an indispensable "stabilizer" in the global supply chain. More importantly, this round of prosperity is continuing to transmit, directly driving the optoelectronic components industry into a new upward cycle.
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