SERVICE
-
IC Counterfeit Detection
- IC Counterfeit Detection-Introduce
-
Non-Destructive Testing (NDT)
-
Destructive Testing
-
Value-Added Services
-
Destructive Physical Analysis (DPA)
- Destructive Physical Analysis (DPA)-Introduce
- External Visual Inspection
- X-Ray inspection
- Functional Testing (FT)
- Particle Impact Noise Detection (PIND/PIN-D)
- Hermeticity
- Internal Water Vapor
- Scanning Acoustic Tomography (SAT Testing)
- Solderability Test
- Decapsulation/Delid Test
- Bond Strength
- Die Shear Strength
- Configuration
-
Failure analysis
- Failure analysis-Introduce
-
Non-Destructive Analysis
-
Electrical Testing
-
Fault Location
-
Destructive Physical Analysis (DPA)
-
Physical Analysis
-
Engineering Sample (ES) Packaging Service
-
Competitor Analysis
-
Development and Functional Verification
- Development and Functional Verification-Introduce
-
New Product Development Testing (FT)
-
Key Functional Testing
-
Materials Analysis
- Materials Analysis-Introduce
-
FIB Circuit Edit
-
Structural Observation
-
Compositional Analysis
- EDS Analysis
-
Reliability Testing
- Reliability Testing-Introduce
-
Reliability Verification of Automotive Integrated Circuits (ICs)
-
Environmental Testing
-
Mechanical Testing
- Pull Test
- Die Strength Test
- High Strain Rate Test - Vibration Test
- Low Strain Rate Test - Bending Test
- High Strain Rate Test - Mechanical Shock Test
- Package Assembly Integrity Test - Wire Bonding Integrity
- Package Assembly Integrity Test
- Combined Vibration/Temperature/Humidity Test
- Combined Temperature/Humidity/Vibration/Altitude Test
- Free Fall Drop Test
- Box Compressive Strength Test
-
Corrosion Testing
-
IP Waterproof/Dust Resistant Test
-
Electromagnetic Compatibility (EMC)
- Electromagnetic Compatibility (EMC)-Introduce
- Immunity to Conducted Disturbances, Induced by Radio Frequency (RF) Fields
- Conducted Immunity Test
- Specific Absorption Rate (SAR) Testing for Electromagnetic Radiation
- Electrical Fast Transient/Burst (EFT/B) Test
- Voltage Flicker/Fluctuation Test
- Voltage Dips, Short Interruptions and Voltage Variations Immunity Test
- Power Frequency Magnetic Field (PFMF) Immunity Test
- Harmonic Interference Test
- Electrostatic Discharge (ESD) Immunity Test
- Surge/Lightning Immunity Test
- Radiated Emissions (RE) Test
- Radio Frequency (RF) Test
-
Chemical Analysis
- Chemical Analysis-Introduce
-
High-Performance Liquid Chromatography (HPLC)
-
Pyrolysis-Gas Chromatography-Mass Spectrometry (PY-GC-MS)
-
Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
- Flame Retardancy Test
标签检测(Label Detection)
描述:验标是根据客户所提供的标签照片和原厂标签、官网信息等进行对比分析,从而辨别其真伪;
我们的优势:拥有庞大的原装标签数据库,能快速准确的与原装标签进行比对。
注意事项:
1.验标结论仅供参考,应以实物为准,如需确认产品是否原装,可以提供样品进行外观检测或者开盖对比验证;
2.为保护广大采购朋友,标签的问题点暂时不能指出,防止造假人员知晓原标排版;
3.验标服务为自愿原则,客户自己承担风险,创芯在线检测中心对此不负任何后果和法律责任。
标签事例: