Description:

This is a quick sample preparation method which comes up with clear sample surface by local grinding with sandpaper (or diamond sandpaper) or grinding head followed by polishing. From the chip backside, grind the substrate to a specified thickness before performing polishing. The main purpose is to enable the following analysis.

Basic Process of Sample Cross-sectioning:

Cutting: Cut sample into proper sizes using a cutter;

Cold Fill: Fill mix glue into gaps of sample to enhance structural strength of the sample, so that it is not damaged by the grinding stress;

Grinding: Grind the sample with different sand paper (or diamond sandpaper);

Polishing: Polish with a turntable added with proper polishing liquid to eliminate fine scratches resulting from grinding.

Scope of Application:

IC products, such as flip chip, Al/Cu process structure, C-MOS Image Sensor; PCB/PCBA products; LED products.

Testing Images:

Backside Grinding:

Backside Grinding of General IC

Backside Grinding of COB Sample

OBIRCH Image After Backside Polishing

Cross-section:

Package Sample Cross-section

MOSFET Cross-section

Cu Process Cross-section