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Bond Strength

Description:

The purpose of bond strength testing is to assess the distribution of bond strength or determine if the bond strength meets the requirements specified in the applicable purchase documents. It can be applied to lead-to-chip, lead-to-substrate, or internal lead-to-package lead bonding inside microelectronic device packages with internal leads that are bonded by using low heat welding, thermocompression bonding, ultrasonic welding, or related bonding techniques. It can also be applied to external wire bonding of devices such as lead-substrate or wire bonding on circuit boards, or internal bonding between chip-substrate in devices that do not use internal leads (such as beam lead or flip-chip device).


Scope of Application:

Silicon wafer, metal part, wafer, lead, aluminum tape, plastic device, ultrasonic wire bonding of Al wire, semiconductor microdevice, microelectronic device lead, flexible substrate, integrated circuit copper lead, etc.


Images of Bond Strength Test:









Destructive Testing (PASS)


Image of Bond Strength Testing Equipment:



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