Description:

For WLCSP (Wafer-level Chip Scale Package) chip products, when performing FIB (Focused Ion Beam) circuit repair, most of the circuits are covered by surface solder balls and RDL (Redistribution Layer), making it impossible to repair the circuits in these areas in the past. Additionally, for the few uncovered areas, the presence of a thicker organic passivation layer above increases the difficulty and time required for circuit repair.

The WLCSP circuit edit technology enables circuit edit in areas beneath solder balls, RDL, or beneath the organic passivation layer for such products.

Scope of Application:

Wafer-level chip scale package.

Testing Images:

Example of WLCSP Circuit Edit: Circuit edit is performed by cutting a metal wire under the solder ball and organic passivation.

WLCSP Circuit Edit Site: Through unique pre-processing techniques and fast and precise local removal of the organic passivation layer, FIB circuit edit can be performed in the entire Site 1-3.