Description:

For IC structure analysis, we will provide you with information on advanced IC devices, IC packaging and structures, including process details and dimensions available in the market to learn about the newest trend, avoid patent traps.

Scope of Application:

IC Package Analysis: Package type, external appearance, internal structure X-Ray inspection;

IC Physical Structure: Die appearance, metal material analysis, process analysis;

Parameter Measurement of IC Package: Package size, thickness of leadframe, wire bonding width, loop height of wire bonding, material of epoxy and wire;

Circuit layout structure and layer analysis of BGA substrate.

Testing Images:

IC Process Identification: