Description:

3D OM (3D Optical Microscope) has advantages such as large depth of field,  inclinable angle detection, and advanced measurement capabilities. It can perform on the device under test of different heights at multi angles and obtain clear images for observation. 3D OM is suitable for electronic component solder joint inspection and failure analysis.

Scope of Application:

Detection of part IC package defects, such as appearance integrity, the black gum cracks, pin deformation or discoloration.

Detection of potential PCB defects, such as nodules, weave exposure, glass fiber exposure, solder mask, markings, etc.

Detection of potential detects in electronic products, such as poor soldering.

Solder ball integrity inspection of BGA and flip chip packages, such as ball deformation.

Appearance inspection and analysis of various types of active and passive components.

Analysis and measurement of all semiconductor components.

Images of 3D OM Testing:

Image of 3D OM Equipment: