Login | Join Free

Hotline

+86-0755-23984412
Package Assembly Integrity Test

Description:

The Package Assembly Integrity Test is a key test in automotive electronics reliability verification which covers Wire Bond Shear (WBS), Wire Bond Pull (WBP), Solderability (SD), Physical Dimensions (PD), and Solder Ball Shear (SBS), Lead Integrity (LI) according to specifications set by the Automotive Electronics Council (AEC).


Scope of Application: 

ICs.


Testing Images:

Solderability (SD)


TDDB Solder Ball Shear (SBS)



Image of Testing Equipment:


RELATED INFO