Description:

Ion Beam Cross-section Polishing (CP), is used for revealing sample cross-sections by means of ion beam. Unlike the general CP, CP is capable of eliminating stress effects resulting from the polishing process.

CP can be used for 1mm size cross-section preparation of any material. It is ideal for material characteristics analysis (e.g. EDS, AES and EBSD) as it suffers no impact of stress. Its effective sample treatment area may get up to 500μm.

Scope of Application:

Soft materials, such as copper, aluminum, gold, tin, polymer (caution shall be taken for melting temperature);

Hard materials such as ceramic and glass, etc;

Heterogeneous materials consisting of two or more materials, such as the combination of metal, ceramic or polymer materials.

Testing Images:

Bump:

TSV Hole:

Copper RDL Plating:

Testing Equipment:

Sample Maximum Size: 11mm(W) x 10mm(D) x 2mm(T)