Description:

Die shear strength testing is primarily used to assess the adhesion strength between the semiconductor die and the substrate. It evaluates the reliability of the materials and process steps used for die mounting on the substrate and serves as a test method for it package quality. The magnitude of the shear force is used to determine if the die packaging quality meets the requirements. Additionally, the fault location and failure mode of the die during shear testing are analyzed to promptly identify and correct any issues that may have occurred during the die packaging process.

Scope of Application:

All microelectronic devices.

Images of Die Shear Strength Test:

Image of Die Shear Strength Testing Equipment: