Description:

Mechanical shock test is performed in the laboratory to simulate a series of impacts that a product may experience in its working environment to evaluate its functionality and identify potential performance failures. In the actual storage, transportation, and daily use, various impact environments are encountered, such as braking during vehicle running or collision during goods handling.

The technical parameters for the test include: peak acceleration, pulse duration, velocity change (half-sine wave, post-peak sawtooth wave, trapezoidal wave), and waveform selection. Conventional mechanical shock testing requires three impacts on each face, totaling 18 impacts on all six faces. Mechanical shock and impact testing can identify weak areas in the mechanical structure and evaluate the integrity and reliability of the product’s structure.

Mechanical shock usually produces high acceleration and short duration, resembling mechanical collisions in natural environments. Mechanical shock can have harmful effects on the structure and functional integrity of the product. Laboratory mechanical shock testing typically involves three types of waveforms: half-sine wave, trapezoidal wave (square wave), and triangular wave (leading and trailing sawtooth waves).

Purpose: The mechanical shock test is aimed to evaluate the ability of solder joints to withstand external stress caused by dynamic and severe bending during the manufacturing process, packing, shipping, and daily use of board-level IC packages and assess the impact on their lifespan.

Failure Mode: The mechanical shock test is aimed at verifying shock resistance of product and solder joints’ resistance against external stress at the moment of shock (high G-values). Real-time monitoring systems can be used to observe the product’s status during the test. Dye and pry or cross-section analysis can be performed afterward to observe the areas and extent of solder joint cracking.

Scope of Application: 

ICs, components and other electrical and electronic products.

Testing Images:

Image of Testing Equipment: