SERVICE
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IC Counterfeit Detection
- IC Counterfeit Detection-Introduce
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Non-Destructive Testing (NDT)
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Destructive Testing
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Value-Added Services
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Destructive Physical Analysis (DPA)
- Destructive Physical Analysis (DPA)-Introduce
- External Visual Inspection
- X-Ray inspection
- Functional Testing (FT)
- Particle Impact Noise Detection (PIND/PIN-D)
- Hermeticity
- Internal Water Vapor
- Scanning Acoustic Tomography (SAT Testing)
- Solderability Test
- Decapsulation/Delid Test
- Bond Strength
- Die Shear Strength
- Configuration
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Failure analysis
- Failure analysis-Introduce
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Non-Destructive Analysis
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Electrical Testing
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Fault Location
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Destructive Physical Analysis (DPA)
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Physical Analysis
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Engineering Sample (ES) Packaging Service
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Competitor Analysis
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Development and Functional Verification
- Development and Functional Verification-Introduce
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New Product Development Testing (FT)
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Key Functional Testing
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Materials Analysis
- Materials Analysis-Introduce
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FIB Circuit Edit
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Structural Observation
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Compositional Analysis
- EDS Analysis
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Reliability Testing
- Reliability Testing-Introduce
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Reliability Verification of Automotive Integrated Circuits (ICs)
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Environmental Testing
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Mechanical Testing
- Pull Test
- Die Strength Test
- High Strain Rate Test - Vibration Test
- Low Strain Rate Test - Bending Test
- High Strain Rate Test - Mechanical Shock Test
- Package Assembly Integrity Test - Wire Bonding Integrity
- Package Assembly Integrity Test
- Combined Vibration/Temperature/Humidity Test
- Combined Temperature/Humidity/Vibration/Altitude Test
- Free Fall Drop Test
- Box Compressive Strength Test
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Corrosion Testing
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IP Waterproof/Dust Resistant Test
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Electromagnetic Compatibility (EMC)
- Electromagnetic Compatibility (EMC)-Introduce
- Immunity to Conducted Disturbances, Induced by Radio Frequency (RF) Fields
- Conducted Immunity Test
- Specific Absorption Rate (SAR) Testing for Electromagnetic Radiation
- Electrical Fast Transient/Burst (EFT/B) Test
- Voltage Flicker/Fluctuation Test
- Voltage Dips, Short Interruptions and Voltage Variations Immunity Test
- Power Frequency Magnetic Field (PFMF) Immunity Test
- Harmonic Interference Test
- Electrostatic Discharge (ESD) Immunity Test
- Surge/Lightning Immunity Test
- Radiated Emissions (RE) Test
- Radio Frequency (RF) Test
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Chemical Analysis
- Chemical Analysis-Introduce
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High-Performance Liquid Chromatography (HPLC)
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Pyrolysis-Gas Chromatography-Mass Spectrometry (PY-GC-MS)
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Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
- Flame Retardancy Test
Description:
Chemical analysis is an absolute quantification method that calculates the quantity of the component to be measured based on the amount of the sample, the amount of reaction product, or the amount of consumed reagent and the stoichiometric relationship of the reaction. Instrumental analysis is another important method of analysis, which is a relative quantification method based on a standard calibration curve.
Chuangxin Testing uses analytical instruments such as mass spectrometers, spectrometers, chromatographs, and nuclear magnetic resonance spectrometers to perform qualitative and quantitative analysis of substance composition, enabling professional analysis of complex samples with multiple components, allowing for formulation improvement and product performance enhancement.
Objectives of Composition Analysis:
1)Understand raw material composition and quality control;
2)Analyze product composition and deduce the basic formulation;
3)Prove the absence of certain components;
4)Investigate the causes of product performance decline;
5)Determine component content to understand product performance;
6)Solve problems in the production process;
7)Compare products of the same model from different periods;
8)Quickly identify the causes of unknown substance generation and eliminate hidden dangers;
9)Improve product formulation and imitate production.
Application Fields of Composition Analysis:
1.Solids, liquids, gases, powders, solvents, raw materials, particles, materials, organic substances, inorganic substances, etc.
2.Polymer materials: plastics, rubber, inks, coatings, adhesives, plastics, etc.
3.Fine chemicals: cleaning agents, metal surface treatment agents, metal working fluids, oil additives, chemical additives, food additives, additives, textile printing and dyeing auxiliaries, release agents, water treatment additives, construction additives, chemical reagents, leather additives, papermaking additives, etc.
4.Others: plant extracts, oils, food, pharmaceuticals, cosmetics, building materials, flavors and fragrances, chemicals, industrial products, soil, ore minerals, coal, etc.
Common Analytical Methods:
Gravimetric analysis, titration, potentiostatic electrolysis, infrared carbon/sulfur analysis, spark direct reading spectroscopy, atomic absorption spectroscopy, X-ray fluorescence (XRF), thermogravimetric (TGA), high performance liquid chromatography (HPLC), UV-visible spectrophotometry, Fourier transform infrared spectroscopy (FTIR), pyrolysis/gas chromatography/mass spectrometry (PY-GC-MS), scanning electron microscopy (SEM) /X-ray energy dispersive spectroscopy (EDS), inductively coupled plasma atomic emission spectroscopy (ICP-OES).