Description:

Thermal EMMI uses detector made of InSb to receive thermal radiation generated by a defective point after power-on, therefore positioning the defects (hot spots/bright spots); or, even estimating the depth of defects via time difference of thermal radiation transmission. 

Scope of Application: 

IC semiconductor industry, TFT LCD panel industry, PCB/PCBA industry.

Testing Content:

Detect the defect caused short-circuits inside IC packaging as well as sole die;

Current Leakage of dielectric layer (oxide);

Current Leakage in transistors and diodes;

Metal circuit defects and short-circuits in TFT LCD Panel & PCB/PCBA;

ESD latch-up;

Estimation the depth of the defect in 3D packaging (stacked die);

Defect positioning detection over non-decapped ICs;

Failure analysis over low impedance short circuit (<10ohm).

Testing Images:

IC Top Marking: IC Top Marking is clearly visible at low magnification.

Low Impedance Short Circuit: In extremely low impedance of short-circuit samples, InGaAs and OBIRCH cannot detect bright spots, but thermal EMMI can successfully and clearly detect bright spots. The relative coordinates of the bright spots can be measured, which facilitates subsequent processes of delayering or cross-section positioning.

Detecting IC Without Decapsulation: IC defect can be clearly shown by hot spot imaging without de-capsulation of the IC. When combined with X-ray, it can clearly determine whether it is a bare die defect or a packaging issue.

Short Circuit in PCB: Short-circuit in PCB can also be revealed by hot spot imaging.

Image of Testing Equipment: