Description:

Intermittent Operating Life (IOL) testing subjects the chip to repeated cycles of high and low temperatures caused by the repeated on and off operations, accelerating the thermal-mechanical stress on various component materials and interfaces inside the chip. This verifies the ability of the package and internal wire bonding to withstand the thermal-mechanical stress caused by chip operations.

Failure mode: Internal wire bonding abnormalities.

Scope of Application :

Semiconductor discrete devices, following the automotive electronics standard according to AEC.

Images of Testing Equipment: