Description:

Discrete semiconductor devices include electronic components (resistors, capacitors, and inductors) and electronic devices (diodes, transistors). Their role in electronic circuits cannot be ignored, and their performance directly affects the operation of the entire PCBA board.

1.Routine Testing:

This mainly involves testing the appearance, dimensions, electrical performance, and safety performance of electronic components. 

Based on the component’s specification sheet, basic parameters such as the appearance, dimensions, ICBO, VCEO, VCES, HFE, pin tension, pin bending, solderability, and soldering heat resistance are tested. Some exported products also require RoHS testing.

2.Reliability Testing:

This primarily involves testing the lifespan and environmental conditions of electronic components. 

Based on the requirements of the user and the specifications, the lifespan and various environmental tests of the devices are conducted. For example, for transistors, tests such as high-temperature testing, low-temperature testing, humidity testing, vibration testing, maximum load testing, and high-temperature durability testing are performed.

3.DPA Analysis:

This focuses on controlling the internal structure and processes of the devices. 

For example, for transistors, X-ray inspection is used to examine the internal structure, acoustic scans monitor the internal structure and packaging processes, and opening monitoring examines the internal wafer structure and dimensions. X-ray fluoroscopy is increasingly favored by electronic product manufacturers due to its non-destructive, fast, user-friendly, and relatively low-cost characteristics. X-ray inspection can be used to check the internal status of components, such as chip layout, lead arrangement, lead frame design, solder balls (leads), etc. For complex structural components, the angle, voltage, current, contrast, and brightness of the X-ray tube can be adjusted to obtain effective image information.

Image of Testing Equipment: