Description:

A die must be linked with the substrate to fulfill its intended function; a wire bonding is to connect the signal from a die to the substrate.

Scope of Application:

PCB development and packaging projects;

Rework of rejected ICs sample preparation, backside sample preparation;

Push and pull test (ball shear/wire pull/solder ball shear/die shear);

Wire Bonding/Molding/Capping;

Varieties of wire bonding methods: driver IC, COB, Chip-To-Chip, Ball Mounting.

Testing Images:

Stud Bumping: Mounting a ball on a solder pad, primarily bonded with Au wires.

Backside Sample Preparation: A ball-type joint at the first connection and a wedge joint at the second connection. The placement of bonding wire takes the center of the ball-type joints. Mainly bonded with Au and copper wires.

COB Bonding: Both the first and second joint are wedge-shaped, so the bonding direction has to be parallel to the pad. Aluminum (Al) wire is normally used.

Driver IC Bonding:

Ceramic Package: