SERVICE
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IC Counterfeit Detection
- IC Counterfeit Detection-Introduce
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Non-Destructive Testing (NDT)
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Destructive Testing
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Value-Added Services
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Destructive Physical Analysis (DPA)
- Destructive Physical Analysis (DPA)-Introduce
- External Visual Inspection
- X-Ray inspection
- Functional Testing (FT)
- Particle Impact Noise Detection (PIND/PIN-D)
- Hermeticity
- Internal Water Vapor
- Scanning Acoustic Tomography (SAT Testing)
- Solderability Test
- Decapsulation/Delid Test
- Bond Strength
- Die Shear Strength
- Configuration
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Failure analysis
- Failure analysis-Introduce
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Non-Destructive Analysis
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Electrical Testing
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Fault Location
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Destructive Physical Analysis (DPA)
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Physical Analysis
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Engineering Sample (ES) Packaging Service
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Competitor Analysis
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Development and Functional Verification
- Development and Functional Verification-Introduce
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New Product Development Testing (FT)
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Key Functional Testing
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Materials Analysis
- Materials Analysis-Introduce
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FIB Circuit Edit
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Structural Observation
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Compositional Analysis
- EDS Analysis
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Reliability Testing
- Reliability Testing-Introduce
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Reliability Verification of Automotive Integrated Circuits (ICs)
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Environmental Testing
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Mechanical Testing
- Pull Test
- Die Strength Test
- High Strain Rate Test - Vibration Test
- Low Strain Rate Test - Bending Test
- High Strain Rate Test - Mechanical Shock Test
- Package Assembly Integrity Test - Wire Bonding Integrity
- Package Assembly Integrity Test
- Combined Vibration/Temperature/Humidity Test
- Combined Temperature/Humidity/Vibration/Altitude Test
- Free Fall Drop Test
- Box Compressive Strength Test
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Corrosion Testing
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IP Waterproof/Dust Resistant Test
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Electromagnetic Compatibility (EMC)
- Electromagnetic Compatibility (EMC)-Introduce
- Immunity to Conducted Disturbances, Induced by Radio Frequency (RF) Fields
- Conducted Immunity Test
- Specific Absorption Rate (SAR) Testing for Electromagnetic Radiation
- Electrical Fast Transient/Burst (EFT/B) Test
- Voltage Flicker/Fluctuation Test
- Voltage Dips, Short Interruptions and Voltage Variations Immunity Test
- Power Frequency Magnetic Field (PFMF) Immunity Test
- Harmonic Interference Test
- Electrostatic Discharge (ESD) Immunity Test
- Surge/Lightning Immunity Test
- Radiated Emissions (RE) Test
- Radio Frequency (RF) Test
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Chemical Analysis
- Chemical Analysis-Introduce
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High-Performance Liquid Chromatography (HPLC)
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Pyrolysis-Gas Chromatography-Mass Spectrometry (PY-GC-MS)
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Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
- Flame Retardancy Test
IC (Integrated Circuit) refers to a chip made by integrating numerous miniaturized electronic components, such as transistors, resistors, capacitors, diodes, etc. onto a single plastic substrate. In a broad sense, the concept of an IC chip encompasses semiconductor component products.
In 2010, due to various factors in the financial market, China’s IC market experienced a situation where the demand exceeded the supply. Many mainstream IC products encountered a stagnation in production lines since late 2009. Consequently, numerous terms related to ICs emerged in the Chinese IC market, including new bulk, refurbished/recycled, re-labeled, and new and original products.
Bulk: There are two types of bulk products. One type refers to products directly entering the market without undergoing quality control (QC) by the manufacturers, indicating a lower qualification rate. The other type refers to products from manufacturers without external packaging that exhibit oxidation, indentation, or scratching, among other issues.
Refurbished/Recycled: This type of product is obtained through various channels by profit-oriented enterprises in China. They re-mark these products with new model and batch numbers. Another form of refurbished product involves re-screening ICs with the same functions but different brands and types within the same package.
Re-labeled: After repainting and typing different batches of old goods, they will be changed to a brand new unified batch.
New and Original: These are fully intact products purchased directly from the original manufacturer or their authorized agents. The external packaging adheres to the requirements of the original manufacturer, and the performance complies with the product specifications.
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