SERVICE
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IC Counterfeit Detection
- IC Counterfeit Detection-Introduce
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Non-Destructive Testing (NDT)
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Destructive Testing
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Value-Added Services
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Destructive Physical Analysis (DPA)
- Destructive Physical Analysis (DPA)-Introduce
- External Visual Inspection
- X-Ray inspection
- Functional Testing (FT)
- Particle Impact Noise Detection (PIND/PIN-D)
- Hermeticity
- Internal Water Vapor
- Scanning Acoustic Tomography (SAT Testing)
- Solderability Test
- Decapsulation/Delid Test
- Bond Strength
- Die Shear Strength
- Configuration
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Failure analysis
- Failure analysis-Introduce
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Non-Destructive Analysis
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Electrical Testing
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Fault Location
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Destructive Physical Analysis (DPA)
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Physical Analysis
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Engineering Sample (ES) Packaging Service
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Competitor Analysis
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Development and Functional Verification
- Development and Functional Verification-Introduce
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New Product Development Testing (FT)
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Key Functional Testing
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Materials Analysis
- Materials Analysis-Introduce
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FIB Circuit Edit
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Structural Observation
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Compositional Analysis
- EDS Analysis
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Reliability Testing
- Reliability Testing-Introduce
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Reliability Verification of Automotive Integrated Circuits (ICs)
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Environmental Testing
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Mechanical Testing
- Pull Test
- Die Strength Test
- High Strain Rate Test - Vibration Test
- Low Strain Rate Test - Bending Test
- High Strain Rate Test - Mechanical Shock Test
- Package Assembly Integrity Test - Wire Bonding Integrity
- Package Assembly Integrity Test
- Combined Vibration/Temperature/Humidity Test
- Combined Temperature/Humidity/Vibration/Altitude Test
- Free Fall Drop Test
- Box Compressive Strength Test
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Corrosion Testing
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IP Waterproof/Dust Resistant Test
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Electromagnetic Compatibility (EMC)
- Electromagnetic Compatibility (EMC)-Introduce
- Immunity to Conducted Disturbances, Induced by Radio Frequency (RF) Fields
- Conducted Immunity Test
- Specific Absorption Rate (SAR) Testing for Electromagnetic Radiation
- Electrical Fast Transient/Burst (EFT/B) Test
- Voltage Flicker/Fluctuation Test
- Voltage Dips, Short Interruptions and Voltage Variations Immunity Test
- Power Frequency Magnetic Field (PFMF) Immunity Test
- Harmonic Interference Test
- Electrostatic Discharge (ESD) Immunity Test
- Surge/Lightning Immunity Test
- Radiated Emissions (RE) Test
- Radio Frequency (RF) Test
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Chemical Analysis
- Chemical Analysis-Introduce
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High-Performance Liquid Chromatography (HPLC)
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Pyrolysis-Gas Chromatography-Mass Spectrometry (PY-GC-MS)
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Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
- Flame Retardancy Test
IC真伪检测
IC(IntegratedCircuit集成电路)是指将很多的微电子元器件(如晶体管、电阻、电容、二极管等)集成的集成电路放在一块塑料基板上,做成的一块芯片。IC芯片的概念广义的讲,就是半导体元件产品的统称。
2010年,由于金融市场的各个因素,国内IC市场,主流的一些IC产品,从09年底到目前,出现了供不应求,大部分厂家生产线停滞不前的现象。由于这种现象,国内IC市场出现了大量IC方面的名词:散新货、翻新货、原字原脚货、全新原装货。
散新货:散新货分两种,一种是生产厂家,没有进过QC而走入市场的产品,这里面合格率不是很高;另一种生产厂家没有外包装,如有氧化、压痕、划痕等现象的产品。
翻新货:这类货通过国内一些只追求利润率的企业,将各种渠道回收回来的货,重新丝印换成新的型号、批号;而另一种是将同一种封装的型号,不同品牌相同功能的IC,重新丝印换成新的型号、批号。
原字原脚货:对相同类型的封装,把不同型号/批号的产品封盖替换到另一产品上。
全新原装货:通过原厂或原厂代理采购的,外包装符合原厂包装要求,性能符合产品规格书的完整产品。
IC真伪检测图片:
RELATED INFO
Common IC authenticity detection methods
2024-07-19