SERVICE
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IC Counterfeit Detection
- IC Counterfeit Detection-Introduce
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Non-Destructive Testing (NDT)
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Destructive Testing
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Value-Added Services
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Destructive Physical Analysis (DPA)
- Destructive Physical Analysis (DPA)-Introduce
- External Visual Inspection
- X-Ray inspection
- Functional Testing (FT)
- Particle Impact Noise Detection (PIND/PIN-D)
- Hermeticity
- Internal Water Vapor
- Scanning Acoustic Tomography (SAT Testing)
- Solderability Test
- Decapsulation/Delid Test
- Bond Strength
- Die Shear Strength
- Configuration
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Failure analysis
- Failure analysis-Introduce
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Non-Destructive Analysis
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Electrical Testing
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Fault Location
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Destructive Physical Analysis (DPA)
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Physical Analysis
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Engineering Sample (ES) Packaging Service
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Competitor Analysis
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Development and Functional Verification
- Development and Functional Verification-Introduce
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New Product Development Testing (FT)
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Key Functional Testing
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Materials Analysis
- Materials Analysis-Introduce
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FIB Circuit Edit
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Structural Observation
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Compositional Analysis
- EDS Analysis
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Reliability Testing
- Reliability Testing-Introduce
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Reliability Verification of Automotive Integrated Circuits (ICs)
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Environmental Testing
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Mechanical Testing
- Pull Test
- Die Strength Test
- High Strain Rate Test - Vibration Test
- Low Strain Rate Test - Bending Test
- High Strain Rate Test - Mechanical Shock Test
- Package Assembly Integrity Test - Wire Bonding Integrity
- Package Assembly Integrity Test
- Combined Vibration/Temperature/Humidity Test
- Combined Temperature/Humidity/Vibration/Altitude Test
- Free Fall Drop Test
- Box Compressive Strength Test
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Corrosion Testing
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IP Waterproof/Dust Resistant Test
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Electromagnetic Compatibility (EMC)
- Electromagnetic Compatibility (EMC)-Introduce
- Immunity to Conducted Disturbances, Induced by Radio Frequency (RF) Fields
- Conducted Immunity Test
- Specific Absorption Rate (SAR) Testing for Electromagnetic Radiation
- Electrical Fast Transient/Burst (EFT/B) Test
- Voltage Flicker/Fluctuation Test
- Voltage Dips, Short Interruptions and Voltage Variations Immunity Test
- Power Frequency Magnetic Field (PFMF) Immunity Test
- Harmonic Interference Test
- Electrostatic Discharge (ESD) Immunity Test
- Surge/Lightning Immunity Test
- Radiated Emissions (RE) Test
- Radio Frequency (RF) Test
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Chemical Analysis
- Chemical Analysis-Introduce
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High-Performance Liquid Chromatography (HPLC)
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Pyrolysis-Gas Chromatography-Mass Spectrometry (PY-GC-MS)
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Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
- Flame Retardancy Test
Description:
Reliability testing refers to conducting various tests to understand, evaluate, analyze, and improve the reliability of a product, considering limited samples, time, and cost. It is an essential step in ensuring product reliability throughout research, development, and manufacturing processes.
Objectives of Reliability Testing:
Research and Development Phase: Conduct reliability testing on samples to identify and improve weaknesses in various aspects such as materials, structure, processes, and environmental adaptability. Through iterative testing and improvement, the reliability indicators of the product can be enhanced to meet the predetermined requirements.
Pilot Production Phase: Once the new product is finalized, perform verification tests based on the product’s technical specifications to comprehensively assess whether it meets the specified reliability criteria.
Production Process: Control the quality during the production process. To ensure stable production, reliability tests may be required for each product, based on the designated technical specifications. Additionally, reliability sampling tests may be conducted periodically or by batch. Through reliability testing, the stability of product quality can be evaluated. If product quality declines due to factors such as poor raw materials or uncontrolled process flow, it can be reflected in the reliability testing. Corrective measures can be taken promptly to restore normal product quality.
Post-Mass Production:Reasonable screening of products can eliminate early failures caused by various factors such as defective raw materials, inappropriate process measures, human error, equipment failure, and insufficient quality inspections. This helps improve the overall reliability level of the batch of products.
Study of Failure Mechanisms: Reliability testing, including simulated and field usage tests, allows for an understanding of failure modes and patterns under different environmental and stress conditions. Analyzing failed products can identify the underlying causes (failure mechanisms) and weak points in the products. Corresponding measures can be implemented to enhance the product's reliability level.
Necessity of Reliability Testing:
Identify design flaws.
Determine defects in processing tools and processes.
Identify any flaws in individual components.
Confirm the absence of any variations.
Ensure the integrity of engineering modifications.
Establish and assess the overall product quality level.
Environmental Stress Screening (ESS) is the process of exposing a newly manufactured product to environmental stresses under the permissible strength limits in order to identify and eliminate latent defects introduced during the manufacturing process by means of accelerated techniques, preventing failures during future usage and avoiding unnecessary losses.