What is chip slice analysis? How to conduct slice analysis test?

Date：2021-08-03 18:32:00 Views：8882

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Introduction to slice analysis

Slicing is a sample preparation method of wrapping and sealing the sample with special liquid resin, and then grinding and polishing. The detection process includes sampling, sealing, grinding, polishing, and finally providing morphological photos, judgment or size of crack delamination. Slicing technology, also known as slicing or metallographic slicing and micro slicing (English Name: cross section, X-section), is the most commonly used sample preparation and analysis method to observe the cross-section structure of samples.

Principle of slice analysis

Slice analysis technology is an analysis method used to check the internal and welding conditions of electronic components, circuit boards or mechanism parts. Slicing is a sample preparation method of wrapping and sealing the sample with special liquid resin, and then grinding and polishing. The detection process includes sampling, sealing, grinding, polishing, providing morphological photos, judgment or size of cracking and delamination, so as to expose the internal structure or defects.

Purpose of slice analysis: surface and internal defect inspection of electronic components and SMT process improvement & verification.

Slice analysis test standard: routine standard for slice analysis: IPC-TM-650 2.1.1 E05 / 04

Slice analysis test items

1. PCB structural defects: PCB delamination, hole copper fracture, etc

2. PCBA welding quality inspection:

a. BGA empty welding, false welding, holes, bridging, tin area, etc;

b. Product structure analysis: capacitance and PCB copper foil layer analysis, LED structure analysis, electroplating process analysis, material internal structure defects, etc;

c. Micro size measurement (generally greater than 1um): pore size, tin height, copper foil thickness, etc.

Instruments used: precision cutting machine, embedding machine, grinding and polishing machine, metallographic microscope, electron microscope, etc.

Test process: sampling, embedding, grinding and polishing, observation and photographing

application area : electronic industry, metal / plastic / ceramic products industry, automobile parts and accessories manufacturing industry, communication equipment, scientific research, etc.

Basis standard: ipc-tm 650 2.1.1, ipc-tm 650-2.2.5, IPC a 600, IPC a 610, etc.

Slice analysis steps: sampling → cleaning → vacuum inlay → grinding → polishing → micro etching (if necessary) → analysis (OM Observation, SEM observation, EDS analysis, EBSD analysis, etc.)

Common techniques of chip slice analysis

General micro slicing methods can be divided into longitudinal slicing (cutting in the direction perpendicular to the plate surface) and horizontal slicing (cutting in the direction parallel to the plate surface). In addition, there are also hole cutting and oblique slicing methods.

Slice analysis is a technical means of destructive test on samples. It is one of the most common and important analysis methods in the electronic manufacturing industry. The preparation quality of slice samples in the early stage will directly affect the accuracy of observation and analysis of failure parts.

1. Slice analysis of metallic / non-metallic materials

Objective: To observe the internal structure and defect analysis, electroplating process analysis and sliced samples, which can be used to observe the morphology and analyze the components, observe the internal structure through slicing, and verify the suspected abnormal cracks and cavities found in the samples.

Scope of application: ceramics, plastics, electroplating products, composite materials, weldments, metal / non-metallic products, auto parts and accessories, etc.

Test steps: sampling → cleaning → vacuum inlay → grinding → polishing → micro etching (if necessary) → metallographic microscope / scanning electron microscope observation / composition analysis.

According to standard: ipc-tm 650 2.1.1, etc.

2. Slice analysis of electronic components

Objective: with the development of science and technology and the progress of technology, electronic products are becoming more and more miniaturized, complex and systematic, but their functions are becoming more and more powerful, their integration is higher and higher, and their volume is smaller and smaller. Slice analysis is to confirm the failure of electronic components and analyze the defects of process and raw materials with the help of slice analysis technology and high magnification microscope. The micro slice prepared by micro sectioning technology can be used for structural analysis of electronic components, inspection of surface and internal defects of electronic components.

Application scope: electronic components, communication electronics, led, sensor, etc.

Test steps: sampling → cleaning → vacuum inlay → grinding → polishing → observation.

According to standards: ipc-tm 650 2.1.1, ipc-tm 650-2.2.5, etc.

3. PCB / assembly board slice analysis

Objective: to determine the quality of printed boards by slicing, analyze the causes of defects and test the properties of printed boards. For example: resin contamination, coating cracks, hole wall delamination, solder coating, interlayer thickness, coating thickness, coating thickness in the hole, side corrosion, inner ring width, interlayer coincidence, coating quality, hole wall roughness, etc. The micro slice prepared by the micro sectioning technology of printed circuit board can be used to check the thickness, number of layers, through-hole diameter and through-hole quality of PCB, and to check the internal cavity of PCBA solder joint, interface bonding condition, wetting quality evaluation, etc.

Scope of application: PCB / PCBA, integrated circuit, etc.

Test steps: sampling → cleaning → vacuum inlay → grinding → polishing → micro etching (if necessary) → observation.

According to standards: ipc-tm 650 2.1.1, ipc-tm 650-2.2.5, IPC a 600, IPC a 610, etc.

Main uses of slice analysis:

This is a common sample preparation method for observing the cross-section structure of samples,

1. The sliced samples are usually observed by stereomicroscope or metallographic measuring microscope;

2. The sliced samples can be used for SEM / EDS, SEM and EDS to observe the morphology and analyze the composition;

3. After nondestructive testing, such as X-ray and Sam samples, the suspected abnormal cracking and foreign matter embedding can be observed and verified by slicing;

4. The sliced sample can be combined with FIB for more subtle microscopic incision observation.