Destructive failure analysis of components electronic failure analysis method

Date：2022-10-09 16:50:08 Views：1031

Failure refers to the failure of electronic components. Destructive Physical Analysis is the whole process of a series of inspection and analysis to verify whether the design, structure, materials and manufacturing quality of components meet the requirements of the intended use or relevant specifications, sample components according to their production batches, and perform non-destructive analysis and destructive analysis on component samples. The important components of various electronic systems or electronic circuits are generally different types of components. When it needs more components, it indicates that the complexity of its equipment is high; On the contrary, it is low. Generally, circuit failure is defined as loss of specified function of circuit system.

DPA analysis technology can identify potential defects in materials, processes and other aspects of components in advance. The time when these defects cause component failure is uncertain, but the consequences are serious. Failure analysis is very important to improve product quality and ensure the reliability of electronic components. For the users of components, they should not only provide relevant information, data and failure samples of failed components, but also protect the analysis samples, master certain failure analysis knowledge, and finally practice, verify and use the analysis results to improve the work and improve the reliability of the electronic system.

Failure analysis method of electronic components

1. Pullout insertion method

The pull-out and insertion method refers to monitoring the process of pulling out and inserting a component board or plug-in board, and judging whether the connection interface pulled out and inserted is the place where the fault occurs. It is worth noting that when the pull-out and insertion method is used for failure analysis, during the pull-out and insertion process of the component board or plug-in board, there will be special situations, that is, the places where the state changes are not only the connection interfaces, but also other parts. Therefore, in the application of pull-out and insertion method, attention should be paid to observing each part and subtle changes to make a correct judgment.

2. Sensory discrimination

Sensory discrimination refers to the way to judge whether there is abnormality by observing the appearance of parts, feeling the temperature and hardness of parts by touching, smelling the smell, and listening to the sound. Sensory discrimination is easy to operate and saves money, but the content that can be distinguished will be restricted by sensory ability.

3. Power supply pull off method

The power supply pull off method refers to pull off the normal power supply and voltage to make them in an abnormal state, and then expose the weak links or faults, which can reflect the components and components that are in fault or near fault. This method is generally used in the case of fault caused by long working time or preliminary judgment that the fault is caused by grid fluctuation. It is worth reminding that the power supply pull off method has certain destructiveness. Before using this method, you must check the insurance factor or other factors, and remember not to use it casually.

4. Replacement of spare parts

Through the monitoring of the components or parts that are taken out in doubt, and after the qualified spare parts are replaced, the failure phenomena are compared and analyzed, such as whether the failure phenomena disappear, and finally determine whether the fault source point is in the removed parts. This method is called the replacement of spare parts method.

In conclusion, the destructive analysis of electronic components can be used to analyze the product qualification rate in the electronic component industry, lay a foundation for its process improvement, and play an important role in improving the reliability of the whole machine and reducing costs. The main purpose of specific destructive analysis of electronic components is to determine whether the functions of electronic components meet the design requirements. Through the comparison between specific testing items and design, the quality judgment of electronic components can be completed.