What are the contents of chip testing? IC Chip Reliability Test Standard

Date：2022-10-28 16:13:28 Views：1501

Chips play a similar role to human organs in various electronic devices. In order to achieve this level of reliability, testing and measurement play a vital role in the whole process of chip design and package testing. While semiconductor manufacturing plants accurately control each process parameter of the chip, they will also test at each stage of production to eliminate defective parts as soon as possible. Next, we will briefly introduce the IC chip reliability test, let's have a look!

The chip reliability test is mainly divided into environmental test and life test. The environmental test includes mechanical test (vibration test, impact test, centrifugal acceleration test, lead wire tensile strength test and lead wire bending test), lead wire solderability test, temperature test (low temperature, high temperature and temperature alternation test), damp heat test (constant humidity and alternating damp heat) Special tests (salt spray test, mold test, low pressure test, electrostatic resistance test, ultra-high vacuum test and nuclear radiation test); The life test includes long-term life test (long-term storage life and long-term working life) and accelerated life test (constant stress accelerated life, step stress accelerated life and sequential stress accelerated life), some of which can be selected.

Reliability test

1. Working test of lower temperature limit: the tested sample shall be powered up to run the test program for preliminary test. When the tested sample does not work, gradually reduce the temperature in the chamber to 0 ℃. After the temperature is stabilized, power up and run the test program for 5h. The function and operation of the tested sample should be normal. After the test, take out the sample when the chamber temperature returns to room temperature, and recover it for 2h under normal atmospheric pressure.

Recommended inspection standard: the function and operation of the tested sample should be normal, and there should be no obvious deviation in the appearance.

2. Low temperature storage test Put the sample in the low temperature box to reduce the temperature of the box to - 20 ℃. Store the sample for 16h when it is not working. Take the sample back to the room temperature, and then restore it for 2h. After the power on operation test procedure is carried out, the test sample shall have normal function and operation, and no obvious deviation in appearance. In order to prevent frost and condensation of the test sample during the test, it is allowed to seal the test sample with polyethylene film and then conduct the test. If necessary, a moisture absorbent can also be installed in the seal sleeve.

Recommended inspection standard: the function and operation of the tested sample should be normal, and there should be no obvious deviation in the appearance.

3. Initial test shall be carried out for the test sample of upper temperature limit working test. When the test sample is not working, gradually raise the temperature of the box to 40 ℃. After the temperature is stabilized, power up the system to run the diagnostic program for 5h. The function and operation of the test sample should be normal. After the test, when the box temperature returns to room temperature, take out the sample and recover it for 2h under normal atmospheric pressure.

Recommended inspection standard: the function and operation of the tested sample should be normal, and there should be no obvious deviation in the appearance.

4. High temperature storage test Put the sample in the high temperature box to raise the temperature of the box to 55 ℃, store the sample for 16h when it is not working, take the sample back to room temperature, and recover for 2h.

Recommended inspection standard: the function and operation of the tested sample should be normal, and there should be no obvious deviation in the appearance.

The above is the IC chip reliability test related content compiled by the wound core detection sub group. I hope it will be helpful to you. Our company has a team of professional engineers and industry elites, and has built three standardized laboratories with an area of more than 1800 square meters, which can undertake a variety of test projects such as electronic component test verification, IC authenticity identification, product design material selection, failure analysis, functional testing, factory incoming material inspection and tape weaving.