What is the main purpose of metallographic analysis? 1. Learn about metal material slicing

Date：2022-11-08 14:36:34 Views：1569

Slicing technology, also known as section or metallographic section or microsection (English name: Cross section, X-section), is the most commonly used sample preparation and analysis method to observe the cross-sectional structure of samples. Slice analysis technology is one of the most common and important analysis methods in PCB/PCBA, parts and other manufacturing industries. It is usually used to determine the quality of work and analyze quality anomalies, inspect the quality of circuit boards, detect PCBA welding quality, find the causes and solutions of failure, and evaluate process improvement as the basis for objective inspection, research and judgment.

Application field:

Electronic industry, metal/plastic/ceramic products industry, automobile parts and accessories manufacturing industry, communication equipment, scientific research, electronic component structure observation, such as flip chip, aluminum/copper process structure, COMS, POP, PCB structure and through-hole observation, PCBA solder joint observation, LED structure observation, IMC observation, capacitance, paint thickness, coating, metal and component structure observation, etc.

Main test items:

1. PCB structural defects: PCB delamination, hole fracture, etc.

2. PCBA welding quality inspection:

(1) BGA empty soldering, faulty soldering, holes, bridging, tin area, etc;

(2) Product structure analysis: capacitance and PCB copper foil layer analysis, LED structure analysis, electroplating process analysis, material internal structure defects, etc;

(3) Micro dimension measurement (generally greater than 1 μ m) : pore size, tin loading height, copper foil thickness, etc.

Standards:

IPC-TM 650 2.1.1, IPC-TM 650-2.2.5, IPC A 600, IPC A 610, etc.

Slice analysis steps:

Sampling → cleaning → vacuum mounting → grinding → polishing → micro etching (if necessary) → analysis (OM observation, SEM observation, EDS analysis, EBSD analysis, etc.)

Instrument used:

Precision cutting machine, embedding machine, grinding and polishing machine, metallographic microscope, electron microscope, etc.

Slice analysis is mainly used for:

It is the most commonly used sample preparation method to observe the cross-sectional structure of samples.

1: The sectioned samples are usually observed by stereo microscope or metallographic microscope

2: The sectioned samples can be used for SEM/EDS scanning electron microscopy and energy dispersive spectroscopy to observe the morphology and analyze the composition.

3: Suspected abnormal cracking, foreign matter embedding, etc. found in the samples of X-ray and SAM after NDT can be observed and verified by slicing.

4: The sectioned sample can be combined with FIB for microscopic incision observation.

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