Elements and components screening basis, secondary screening specification, standard and purpose

Date：2022-11-28 15:33:20 Views：1557

Components and parts shall be screened according to relevant screening technical conditions and can only be used after being qualified. In order to prevent false soldering caused by oxidation of welding end after chip component screening, chip component screening shall not be conducted without conditions for solderability treatment of welding end. In order to help you understand deeply, this paper will summarize the knowledge related to the specification, standard and purpose of secondary screening of components. If you are interested in the content to be covered in this article, please read on.

Basis for formulation of secondary screening procedure for components

In principle, failure analysis shall be carried out for the failed products according to the statistics of field use or reliability test of components, and the failure mode and failure mechanism of various components shall be clarified. Different stresses shall be adopted for the internal defects of components, so that the defective products can be exposed in advance and eliminated, while the good products will not be damaged. Various screening stresses formulated shall be verified by a large number of tests, and failure analysis shall be carried out for failure samples, which shall be determined through full demonstration.

Based on current standards, such as GJB584, GJB128, GJB360, etc

Considering the reliability requirements of the whole system on components

Consider the environmental conditions, funds and development cycle of components

The screening regulations are not immutable, but should be changed according to the improvement of component manufacturing technology and the development of test equipment.

The screening requirements of component users are generally determined by the overall model unit

The secondary screening of components is a supplement to the primary screening, and the use conditions and application environment of components should be comprehensively considered on the basis of the primary screening items and stresses.

Particularity: Each unit has different tasks and different requirements for product reliability, so there is no unified screening standard.

Purpose of secondary screening of components

1. The screening test of components mainly refers to the test carried out to remove the products that fail at an early stage. It is a non-destructive test for full inspection of products. By applying environmental stress according to certain procedures, it can stimulate potential design and manufacturing defects of products, so as to eliminate early failure products and reduce the failure rate.

2. The screening of components shall generally be carried out by the component manufacturer in accordance with the military electronic component specification or the contract signed by the supplier and supplier. Generally, the screening conducted by the component manufacturer is called "primary screening". If the technical conditions of "primary screening" cannot fully meet the user's quality requirements for components, the user or its entrusted unit can conduct re screening to supplement the manufacturer's screening deficiencies. Generally, the screening conducted by the user or the entrusting party is called "secondary screening" or "supplementary screening". That is, secondary screening refers to the screening conducted by the user when the "primary screening" test of purchased components fails to meet the technical conditions of the project requirements specified by the user. The purpose of "primary screening" and "secondary screening" of components is basically the same as that of the test method, but it should be emphasized that "secondary screening" should be tailored on the basis of "primary screening".

3. The secondary screening test of components is generally carried out for the finished components, but it can also be carried out for the semi-finished components during the production process. For example, the non-destructive bonding tension test, internal visual inspection and other screening before capping of semiconductor devices with high quality assurance level are all part of the screening of semi-finished products.

The above contents are related to the secondary screening of components and parts organized by the small knitting of core creation detection, and I hope they can be helpful to you. Our company has a team of professional engineers and industry elites, and has built three standardized laboratories with an area of more than 1800 square meters, which can undertake a variety of test projects such as electronic component test verification, IC authenticity identification, product design material selection, failure analysis, functional testing, factory incoming material inspection and tape weaving.