How to conduct the reliability test of optoelectronic components?

Date：2022-11-29 16:08:56 Views：1055

Optoelectronic devices are various functional devices made of photoelectric conversion effect, which can realize the functions of optical signal generation, signal modulation, detection, connection, energy division and combination, energy increase and decrease, signal amplification, photoelectric conversion, electro-optic conversion, etc. Optoelectronic devices are the key and core components of optoelectronic technology, and the detection of optoelectronic components in various industries is an essential basic work. There are many kinds of products that need to be tested for reliability, and the testing needs of each industry are different. Different methods must be used according to different components to determine whether the components are normal or not. What about the reliability test of optoelectronic components? Next, let's have a look.

1、 Physical characteristics test project of optoelectronic components

Tightness: determine the airtightness of optoelectronic device package with internal cavity.

Flammability: Determine the flammability of materials used in optoelectronic devices.

Solderability: determine the solderability of optoelectronic device leads to be soldered.

Wire bonding strength: determine the wire bonding strength of optoelectronic devices using low temperature welding, hot pressure welding, ultrasonic welding and other technologies.

2、 Mechanical integrity test items of optoelectronic components

It is hard to avoid bumping during product transportation and use. Even if the product is installed on the equipment, it is also likely to encounter the vibration caused by the fan. Mechanical shock and vibration refers to the prevention and screening work in advance for various unfavorable conditions that may be encountered by products.

1. Mechanical shock: determine whether optoelectronic devices can be used in electronic devices that need to withstand moderate severe shock. The impact may be caused by sudden force or violent vibration during loading, unloading, transportation or on-site use.

2. Variable frequency vibration: determine the impact of vibration on various components of optoelectronic devices within the specified frequency range.

3. Thermal shock: determine the resistance and effect of optoelectronic devices when subjected to temperature upheaval.

4. Insertion and pull-out durability: determine whether the insertion and pull-out of optical fiber connectors of optoelectronic devices, optical power, loss, reflection and other parameters meet the repeatability requirements.

5. Storage test: determine whether optoelectronic devices can withstand high and low temperature transportation and storage.

6. Temperature cycle: determine the ability of optoelectronic devices to withstand extremely high and low temperatures, as well as the impact of alternating changes of extremely high and low temperatures on optoelectronic devices.

7. Constant damp heat: determine whether sealed and unsealed optoelectronic devices can withstand the specified temperature and humidity at the same time.

8. High temperature life: determine the high temperature accelerated aging failure mechanism and working life of optoelectronic devices.

3、 Accelerated aging test of optoelectronic components

Apply high temperature, high humidity and a certain driving current on the optoelectronic device to accelerate the aging. According to the test results, it can be judged that the optoelectronic devices have functions and lose functions, and can be accepted and rejected. The working conditions of optoelectronic devices can be adjusted and the reliability can be calculated.

1. High temperature accelerated aging: The most basic environmental stress during accelerated aging is high temperature. During the experiment, the selected parameters shall be monitored regularly until the degradation exceeds the end of life.

2. Constant temperature test: the constant temperature test is similar to the high temperature operation test, and the number of samples for constant temperature test and the allowable number of failures shall be specified.

3. Variable temperature test: the high temperature accelerated aging test with variable temperature is to increase the temperature gradually and regularly (such as 60 ℃, 85 ℃ and 100 ℃).

4. Temperature cycling: In addition to the temperature cycling required for optoelectronic devices as an environmental stress test, temperature cycling can also accelerate the aging of tube electronic devices.

The purpose of temperature cycling accelerated aging is not generally to cause degradation of specific performance parameters, but to provide additional instructions on the long-term mechanical stability of the optical path packaged in the module.

In conclusion, the reliability of optical devices is actually a very complex system engineering. In order to improve the use reliability of optoelectronic components, it is necessary to do a good job in the reliability testing and screening of components in the R&D stage, mass production and ex factory stage. The participation of R&D, production, procurement, quality assurance, system management and other aspects can provide a solid guarantee for improving the reliability of electronic products. Chuangxin Testing is a professional testing agency for electronic components. At present, it mainly provides integrated circuit testing services such as capacitance, resistance, connector, MCU, CPLD, FPGA, DSP, etc. Specializing in electronic component function testing, electronic component incoming appearance testing, electronic component dissection testing, acetone testing, electronic component X-ray scanning testing, ROHS component analysis testing. Welcome to call, we will serve you wholeheartedly!