How are chips made? Description of process steps

Date：2022-12-02 15:14:25 Views：1438

From the development history of the chip, the development direction of the chip is high speed, high frequency and low power consumption. The chip manufacturing process mainly includes chip design, chip manufacturing, packaging manufacturing, cost testing and other aspects, among which the chip manufacturing process is particularly complex. Let's take a look at the chip manufacturing process, especially the chip manufacturing process.

First is the chip design. According to the design requirements, the generated "drawings"

1. Raw wafer of the chip

The component of the wafer is silicon, which is refined by Shi Yingsha. The wafer is the silicon element that is purified (99.999%). Next, some pure silicon is made into silicon crystal rods, which become the material for manufacturing quartz semiconductors for integrated circuits. Slicing it is the specific wafer required for chip manufacturing. The thinner the wafer, the lower the production cost, but the higher the process requirements.

2. Wafer coating

Wafer coating can resist oxidation and temperature, and its material is a kind of photoresist.

3. Wafer lithography development and etching

This process uses chemicals that are sensitive to ultraviolet light, that is, they become soft when exposed to ultraviolet light. The shape of the chip can be obtained by controlling the position of the light barrier. The silicon wafer is coated with photoresist, so that it will dissolve in the presence of ultraviolet light. This is the first sunshade that can be used to dissolve the part directly exposed to ultraviolet light, which can then be washed away with solvent. The remaining part is the same as the shape of the sunshade, and this effect is exactly what we want. In this way, we can get the silica layer we need.

4. Adulterate

Ions are implanted into the wafer to generate corresponding class P and N semiconductors.

The specific process is to start from the exposed area on the silicon chip and put it into the chemical ion mixture. This process will change the conductive mode of the doping region, so that each transistor can turn on, off, or carry data. A simple chip can only use one layer, but a complex chip usually has many layers. At this time, this process will be repeated constantly, and different layers can be connected by opening a window. This is similar to the manufacturing principle of all layers of PCB. More complex chips may require multiple silicon dioxide layers, which can be realized through repeated lithography and the above process to form a three-dimensional structure.

5. Wafer test

After the above processes, lattice grains are formed on the wafer. The electrical characteristics of each grain are tested by needle measurement. In general, each chip has a large number of grains, and it is a very complex process to organize a single pin test mode, which requires mass production of models with the same chip specification and structure. The larger the quantity is, the lower the relative cost will be, which is one of the reasons why the cost of mainstream chip devices is low.

6. Encapsulation

Fix the finished wafer, bind the pins, and make different packaging forms according to the requirements, which is why the same chip core can have different packaging forms. For example: DIP, QFP, PLCC, QFN, etc. This is mainly determined by the user's application habits, application environment, market form and other peripheral factors.

7. Testing and packaging

After the above process flow, the chip production has been completed. This step is to test the chip, remove defective products, and package it.

The above contents are related to the chip manufacturing process organized by the core creation detection team. I hope they can help you. Our company has a team of professional engineers and industry elites, and has built three standardized laboratories with an area of more than 1800 square meters, which can undertake a variety of test projects such as electronic component test verification, IC authenticity identification, product design material selection, failure analysis, functional testing, factory incoming material inspection and tape weaving.