What aspects does the product failure analysis FMEA project include?

Date：2022-12-14 15:14:14 Views：925

FMEA is a systematic activity in the product design stage and the process design stage, which analyzes the subsystems and parts constituting the product and each process constituting the process one by one, finds out all potential failure modes, and analyzes their possible consequences, so as to take necessary measures in advance to improve the quality and reliability of the product. In order to enhance everyone's understanding of the product failure analysis FMEA, the following are the relevant contents of the failure analysis FMEA project organized by the small group, hoping to bring you reference and help.

Failure analysis product range

PCBA, high light plate, wiper, automobile harness, automobile panel, automobile navigation, communication module, LED, optical template

Analysis items

1. External inspection

2. Electrical parameter test

3. Non functional test

4. X-ray radiography, X-RAY analysis (3D)

5、PIND

6. Sealing inspection

7. Acoustic scanning microscope analysis (SAM) C-SAM, TEM (transmission electron microscope)

8. Internal inspection

9. Section metallographic analysis

10. Bond strength test

11. Shear strength test

12. Scanning electron microscope analysis (SEM), SEM&EDS

13. Coarse leak detection and fine leak detection

14. Internal atmosphere analyzer

15. Slice

16. Dyeing test

17. FIB (focused ion beam)

18. ESD test

19. Latch up test (power side)

20. Chip shearing force, bonding tension, propulsion ball

21. EMMI (light emission microscope)

22. Infrared thermal imaging system

23. TOF-SIMS (secondary ion mass spectrometry)

Morphological analysis technology: stereomicroscope, metallographic microscope, X-ray fluoroscopy, acoustic scanning microscope, scanning electron microscope, transmission electron microscope, focused ion beam

Composition detection technology: X-ray energy spectrum EDX, Auger energy spectrum AES, secondary ion mass spectrometry SIMS, spectrum, chromatography, mass spectrometry

Electrical analysis technology: I-V curve, semiconductor parameters, LCR parameters, integrated circuit parameters, spectrum analysis, ESD parameters, electronic probe, mechanical probe, insulation withstand voltage, relay characteristics

Opening sample preparation technology: chemical opening, mechanical opening, plasma etching, reactive ion etching, chemical etching, slicing

Defect location technology: liquid crystal hot spot, infrared thermal image, voltage contrast, light emission microscopic image, OBIRCH

According to experience, there are two main reasons for the failure of electronic components: one is abnormal electrical conditions; Second, abnormal working environment. Good electrical conditions depend on the correct design of the circuit. If the component can work under rated condition, its life will be longer. If overloaded, the service life will be shortened. Secondly, environmental conditions such as high temperature, high humidity, dust and corrosive chemicals in the air, ESD, etc. will affect the life of components.

The above is related to the FMEA project of product failure analysis organized by the core creation detection team, and I hope it will be helpful to you. Our company has a team of professional engineers and industry elites, and has built three standardized laboratories with an area of more than 1800 square meters, which can undertake a variety of test projects such as electronic component test verification, IC authenticity identification, product design material selection, failure analysis, functional testing, factory incoming material inspection and tape weaving.