Failure Analysis and Reliability Verification Test of Electronic Products

Date：2022-12-19 15:41:16 Views：913

Reliability is a branch of quality control. However, it is a necessary stage for products to continuously pursue reliability as a specialized technology. The two main contents of reliability research are failure analysis and reliability testing (including destructive experiments). Both of them influence and restrict each other. Therefore, we must attach importance to and accelerate the development of reliability analysis of components, determine the failure mechanism through analysis, find out the cause of failure, feed back to the design, manufacturing and use, and jointly study and implement corrective measures to improve the reliability of electronic components.

Failure analysis project of electronic components

1. Component failure

Inductance, resistance and capacitance: crack, rupture, crack and parameter change

2. Device/module failure

Diode, triode, LED lamp

3. Integrated circuit failure

DIP package chip, PGA package chip, SOP/SSOP series chip, QFP series chip, BGA package chip

4. PCB&PCBA welding failure

Foaming, delamination, solder mask peeling, blackening, migration oxidation, corrosion, open circuit, short circuit, CAF short-term failure on PCB surface; Discoloration of board surface, tin surface and bonding pad; The insulation performance between holes decreases; Deep hole cracking; Bursting plate, etc

Poor welding of PCBA (ENIG, nickel plating, gold plating, OSP, tin spraying plate); Poor tin coating on terminals (pins), foreign matters on the surface, electromigration, component falling off, etc

5. DPA analysis

Resistors/capacitors/thermistors/diodes, etc

Reliability verification service of electronic components

1、 Product reliability system solution

1. Customization of reliability test scheme

2. Reliability enterprise standard formulation and guidance

3. Life assessment and prediction

4. Analysis of Reliability Competitors

5. Product evaluation

6. Device quality improvement

2、 Routine environmental and reliability project inspection methods

1. Environmental reliability of electronic components

High/low temperature test, temperature and humidity test, alternating humidity and heat test, cold and heat shock test, rapid temperature change test, salt spray test, low pressure test, high pressure cooking (HAST), CAF test, gas corrosion test, dust prevention and waterproof/IP grade, UV/xenon lamp aging/solar radiation, etc

2. Mechanical reliability of electronic components

Vibration test, impact test, collision test, drop test, three comprehensive tests, packaging and transportation test/ISTA level, fatigue life test, insertion and removal force test

3. Electrical performance reliability

Withstand voltage, breakdown voltage, insulation resistance, surface resistance, volume resistance, dielectric strength, resistivity, conductivity, temperature rise test, etc

The purpose of failure analysis of electronic components is to confirm the failure phenomenon of electronic components, distinguish their failure mode and failure mechanism, confirm the failure reason of the results, put forward suggestions for improving design and manufacturing process, prevent the recurrence of failure, and improve the reliability of components by means of various testing and analysis technologies and analysis procedures. Our company has a team of professional engineers and industry elites, and has built three standardized laboratories with an area of more than 1800 square meters, which can undertake a variety of test projects such as electronic component test verification, IC authenticity identification, product design material selection, failure analysis, functional testing, factory incoming material inspection and tape weaving.