What are the common detection methods for chip failure cause analysis?

Date：2023-01-06 14:54:34 Views：1475

Failure analysis refers to all technical activities aimed at finding out the cause of failure and taking preventive measures for failed components. It is equivalent to material diagnostics. Various analytical instruments and methods are used to comprehensively analyze fracture defects, find out the causes of failure, and take measures to prevent the recurrence of similar failures. Failure analysis is not only a technical activity to analyze the causes of failed parts, but also a quality management activity, involving design, production, use, maintenance and other fields. Effective failure analysis can often find problems in terms of design rationality, process stability, product reliability, safety and practicality, so that we can improve and prevent them and fundamentally improve product quality.

Once the product fails occasionally, the failure analysis link will start to locate the failure mode, failure reason and failure mechanism. From the perspective of human, machine, material, method and ring, it will be carried out layer by layer and checked one by one. This kind of failure analysis based on the quality system often needs to establish a fault analysis tree or fishbone diagram in order to conduct failure analysis more orderly. To correctly expand the fault analysis tree or fishbone diagram, the first thing to do is to correctly describe the failure phenomenon, and then to investigate the possible causes of this failure phenomenon. Relying on experience can speed up the process of failure analysis and help to quickly locate the root cause of the problem. However, experience sometimes blinds the eyes of those who find problems and cannot find the small differences behind similar failure phenomena. In this way, the same quality problems will occur in the next batch, which will bring a bloody lesson to people. The purpose of failure analysis is to find the essence of the problem, determine the failure mode and failure mechanism, propose effective improvement measures, and improve the yield and reliability. Furthermore, we should draw inferences from other cases.

Failure analysis is generally carried out in the order of non-destructive testing followed by destructive analysis. This is because once the sample is damaged, it is difficult to restore, and some information that may have been ignored can no longer be recovered. Common failure analysis methods are as follows:

(1) Visual inspection

Observe chip surface contamination, cracks, corrosion, metal housing insulator cracks, coating corrosion, falling off, bond wire loss, damage, connection error, etc.

(2) Electrical test

Test device functions, parameters, etc.

(3) X-ray radiography

It is used to check the integrity of key alloy wire, the welding condition of solder joints and pads, and the cavity problem in the sealing area and adhesive area.

(4) Ultrasonic scanning

When ultrasonic wave propagates in objects, it will reflect when encountering the interface of different media. The delamination, cavity, crack and other problems in the packaging structure can be detected by detecting the reflected wave.

(5) SEM and EDS

Observe the microstructure of the failed sample and identify the chemical composition.

(6) Sealing

The airtightness and leakage rate of the device are judged by coarse leak detection and fine leak detection.

（7）PIND

Particle noise is used to detect whether there are movable residues in the device.

(8) Internal atmosphere detection

Measure the type and content of water vapor, oxygen, carbon dioxide and other internal atmosphere inside the sealed device.

(9) Infrared imaging

Observe the hot spot position on the chip surface through infrared imaging to determine whether there are problems such as breakdown and short circuit.

The above is related to the chip failure cause analysis organized by the wound core detection team. I hope it will be helpful to you. Chuangxin Testing is a professional testing agency for electronic components. At present, it mainly provides integrated circuit testing services such as capacitance, resistance, connector, MCU, CPLD, FPGA, DSP, etc. Specializing in electronic component function testing, electronic component incoming appearance testing, electronic component dissection testing, acetone testing, electronic component X-ray scanning testing, ROHS component analysis testing. Welcome to call, we will serve you wholeheartedly!