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What are the applications of X-Ray detection in chip packaging reliability?

Date:2023-01-12 15:22:00 Views:954

X-Ray detection equipment is an effective tool for checking the reliability of chip packaging. It can detect the defects inside the chip packaging to ensure the reliability of chip packaging. In order to improve the packaging quality of products, it is necessary to use X-RAY nondestructive testing equipment to carry out chip packaging testing to maximize the control of inferior products and waste products. This paper will introduce the application of X-ray detection equipment in ensuring the reliability of chip packaging.

Chip packaging is the process of cutting, pasting and bonding the wafer processed in the semiconductor front process, and then covering it with plastic packaging materials to protect the chip components and use it for the assembly and assembly of circuit boards. Chip packaging particles mainly provide a lead bonding interface, which is connected to the chip system through metal pins, spherical joints and other technologies, and protect the chip from damage and corrosion of external environment, including external forces, water, impurities or chemicals.

X-RAY检测在芯片封装可靠性中的应用有哪些?

Application of X-RAY detection in chip packaging reliability

1. X-Ray detection equipment can detect the internal structure of the chip package. It can detect defects such as solder joints, circuit layout, welding conditions and appearance dimensions inside the package, thus effectively ensuring the reliability of the chip package.

2. X-Ray detection equipment can detect the solder joint inside the chip package. It can detect the position, size, shape, etc. of the solder joint, so as to ensure that the position of the solder joint is correct, the size is appropriate, and the shape meets the requirements.

3. X-Ray detection equipment can detect the line layout inside the package. It can detect the position, length, width, etc. of the line, so as to ensure the correct position, length and width of the line.

4. X-Ray detection equipment can detect the welding condition inside the package, and it can detect the welding quality and coverage, so as to ensure that the welding quality and coverage meet the standard.

5. X-Ray detection equipment can detect the defects of chip package appearance size, and it can detect the deviation of chip package appearance size, so as to ensure that the chip package appearance size is correct.

6. X-Ray detection equipment can also detect material defects, surface defects, thermal aging defects, etc. inside the chip package.

The purpose of chip packaging is to ensure that the chip has strong mechanical performance, good electrical performance and heat dissipation performance after packaging. A complete and scientific chip packaging process should first meet the purpose of realizing the internal bonding point and external electrical connection of the integrated circuit chip, and then provide a long-term stable and reliable working environment for the chip, which not only plays the role of mechanical and environmental protection for the chip, but also ensures the high stability and reliability of the normal operation of the chip. X-Ray detection equipment can effectively detect the defects inside the chip package, thus ensuring the reliability of the chip package. Therefore, in the process of ensuring the reliability of chip packaging, the use of X-ray detection equipment is an effective method.

The above is about the application of X-RAY detection in chip packaging reliability, which is compiled by Chuangxin Detection. I hope it can help you. Chuangxin Testing is a professional testing agency for electronic components. At present, it mainly provides integrated circuit testing services such as capacitance, resistance, connector, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, appearance testing of incoming materials of electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, ROHS component analysis and testing. Welcome to call, we will serve you wholeheartedly!