How to bake the chip? Humidity requirements for baking chips

Date：2023-02-15 14:01:29 Views：3765

The storage environment of humidity sensitive components and chips should be kept at about 25 ℃ and relative humidity (RH)<40%. If the temperature and humidity of the storage and operation environment is higher than the standard range, it is necessary to control the folding control of humidity sensitive components and chips. There are still some gaps that may not be visible to the naked eye, but when the integrated circuit chip is placed in the environment, the water in the environment will penetrate into the chip by osmosis. The chip is affected by moisture. In order to improve your understanding of chip baking, the following is the relevant content of core detection and sorting, hoping to bring you reference and help.

When IC, BGA and other integrated circuit chips are affected by moisture, the moisture in their chips will vaporize due to the sharp rise of temperature when they pass through thermal processes such as reflow soldering. This causes the rapid increase of the volume and the expansion and deformation of the chip. In serious cases, popcorn will be directly formed and chips will be directly scrapped. If it is slightly inferior, it will result in the lack of chip functions and other current situations. Slightly, there will be cracks, delamination, peeling, microcracks and other defects in the interior. These defects will lead to hidden dangers such as short life and poor effect of the chip. It seriously affects the reputation of the enterprise.

Different humidity sensitivity levels have different baking conditions. Generally, 125 degree baking is adopted. If you are worried about oxidation and aging, or the material belt is easy to be deformed at high temperature. It can be baked at 90 °+5% RH or 40 °+5% RH. It is not recommended to use nitrogen-filled ovens. The cost of using nitrogen in nitrogen-filled ovens is too high. If the chip is not baked suddenly, it is easy to cause blistering and delamination damage inside the chip. The purpose of baking is to prevent this reason.

Steps and setting temperature of chip baking:

1. First turn on the oven power and preheat the oven. The technical parameter of preheat temperature is set to 80 ℃ (80 ℃ in general, 100 ℃ in special cases)

2. When the oven temperature is preheated to 80 ℃, tear the plastic bag that packages the chip Put the chip IC chips and BGA chips to be baked into the oven. When the oven is full, close the oven door, bake and start timing.

3. Set the oven temperature of 80 ℃± 10 ℃ and baking time of 2H-4H according to the standard requirements

4. During the baking process, there must be personnel to patrol the operation of the oven, especially the temperature, ventilation equipment and indicator light

5. After baking to the specified time, open the oven, check whether the chip IC chip and BGA chip are dried, and take the chip out of the oven after confirming that it is OK

6. After baking, turn off the power switch of the oven!

Precautions for chip baking:

1. The oven must be preheated to the specified temperature before loading the chip for baking.

2. Under normal circumstances, it must be baked to the specified time before leaving the oven.

3. Do not damage the chip during baking.

4. Do not put cardboard, paper and other flammable materials in the oven! Baking time and temperature shall be controlled and recorded.

Components that need to be baked shall be baked according to the specifications on the warning label. The drying time within the standard can effectively dehumidify the chip. However, factories with conditions can also try to use lower temperature baking conditions for chip baking. In this way, the chip can be dried without extra influence. The best way to prevent chips from getting damp is to use them immediately. Chuangxin Testing is a professional testing agency for electronic components. At present, it mainly provides integrated circuit testing services such as capacitance, resistance, connector, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, appearance testing of incoming materials of electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, ROHS component analysis and testing. Welcome to call, we will serve you wholeheartedly!