How to use X-ray to test the reliability of semiconductor packaging?

Date：2023-02-17 14:59:23 Views：1147

Semiconductor packaging and testing is developing rapidly in China. After packaging, the use of X-Ray testing equipment to test it is to test the production process of the packaged chip to ensure the quality of the device after packaging. Test is a step to verify the function and performance of semiconductor products such as chips and circuits, so as to screen out semiconductor products with structural defects or function and performance that do not meet the requirements, and ensure the normal application of the delivered products.

X-Ray detection equipment is an effective tool for checking the reliability of chip packaging. It can detect the defects inside the chip packaging to ensure the reliability of chip packaging.

The production workshops of semiconductor chips have strict requirements for production conditions, such as constant temperature and humidity, dust-free and clean, etc. The chips can only function normally in a suitable environment, but the normal environment around us cannot do this in most cases, so we need to seal the chips to protect them and create a good working environment for them.

The semiconductor packaging process increases the reliability of the chip and makes the performance of the chip more excellent. However, the packaging process also requires X-Ray detection to ensure its welding quality.

Secondly, the testing process also carries out a round of quality screening for the chip. X-rays can penetrate the packaged semiconductor device, detect the possible quality defects in its internal production process, and add a reliability guarantee for the chip.

X-RAY semiconductor testing equipment has been widely used in integrated circuits, discrete devices, sensors and optoelectronic devices. It can also effectively detect the defects inside the chip package, thus ensuring the reliability of the chip package. Therefore, in the process of ensuring the reliability of chip packaging, the use of X-ray detection equipment is an effective method.

The above is the content related to the reliability of X-ray testing semiconductors compiled by the core creation testing team. I hope it can help you. Our company has a team of professional engineers and industry elites, and has three standardized laboratories with an area of more than 1800 square meters, which can undertake various test projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection and tape weaving.