What is x-ray detection? Which products are applicable?

Date：2023-03-09 14:12:06 Views：1426

X-ray detection is a kind of low-energy x-ray to quickly detect the internal quality of the detected object and the internal quality of the foreign object and the foreign object, and display the image of the detected object through the computer. X-ray is an electromagnetic wave with wave length and wavelength range of 0. 0006-80nm. This kind of electromagnetic wave has strong penetration ability, can penetrate materials with different densities, and also has good penetration to some objects that cannot be penetrated by visible light. To help you understand, the following content is organized by Chuangxin Testing Network for your reference.

X-ray detection principle: X-ray using cathode ray tube will produce high-energy electrons and metal target impact, so during the impact process, the electrons will suddenly decelerate, because the kinetic energy loss caused by deceleration is in the form of X-ray release, with short wavelength, but high electromagnetic radiation energy.

For some items that cannot be detected internally or reach the detection position through the appearance, the light intensity of X-ray is different because of its strong penetration ability, and the density of the material that X-ray penetrates is different, so these different light intensities of X-ray can form corresponding images, which can clearly show the internal structure of the object to be tested, such as SMT, metal castings, semiconductor chips, etc. For electronic components, x-ray can detect IC chips, PCB printed circuit boards, PCBA/SMT/BGA solder joints, lithium batteries, IGBT semiconductors, LED/LCD. For metal casting parts, XRAY can be used for metal castings, welds, cracks, auto parts, pressure vessels, pipes, etc., so as to detect the problem of the object without damaging the object to be tested.

In addition,x-rayIt can also detect cracks and defects of foreign matters in plastic materials and parts, electronic components, LED components, etc., and analyze the internal displacement of BGA, circuit board, etc; Identify BGA welding defects such as empty soldering and faulty soldering, as well as the internal conditions of microelectronic systems and rubber sealing components, cables, fittings and plastic parts.

X-ray inspection There are many products, and the detection principle is the same. Take the detection of voids as an example: when BGA components are welded, voids and voids will inevitably occur. The impact of these defects on BGA solder joints will reduce the mechanical strength of solder joints and affect the reliability and life of solder joints. Therefore, it is necessary to control the occurrence of voids.

In the quality standards of solder joints, the gap plays a decisive role in the quality, especially in large solder joints, the solder joint area can reach 25 cm ²， The change of sealing gas in the cavity is difficult to control. The general result is that the size and part of the gap left in the solder are different. At the heat transfer level, the gap will make the module abnormal, and even cause damage in normal operation. Therefore, quality management is absolutely necessary in the production process.

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