What is metallographic analysis? Standard Specification for Metallographic Analysis and Testing

Date：2023-05-23 15:59:44 Views：907

Metallographic analysis is an analytical method that uses microscopic observation of the microstructure and structure of metal materials to understand their physical and chemical properties. The standard specifications for metallographic analysis and testing are a series of standards and specifications developed to ensure the accuracy and reliability of metallographic analysis. The following is a detailed introduction to metallographic analysis and its detection standards and specifications. If you are interested in the upcoming content, please continue reading the following text, hoping it can be helpful to you.

1、 What is metallographic analysis?

Metallographic analysis is an analytical method based on microscopic observation of the microstructure and structure of metal materials, in order to understand the physical and chemical properties of materials. This method is mainly based on optical microscopy observation, but more detailed information can also be obtained through methods such as electron microscopy and X-ray diffraction. It can observe and analyze the microstructure, crystal structure, phase transformation process, defects and other information of metal materials.

2、 Standard Specification for Metallographic Analysis and Testing

The standard specifications for metallographic analysis and testing are a series of standards and specifications developed to ensure the accuracy and reliability of metallographic analysis. These standard specifications can be divided into material preparation, sample preparation, laboratory conditions, observation methods, and result recording. The following are some common metallographic analysis detection standards:

1. GB/T 231.1-2009 "General Method for Microstructure Inspection of Metallic Materials"

This standard describes general methods for inspecting the microstructure of metal materials, including sample preparation, optical microscopy observation methods, and classification methods for microstructure. It is suitable for various types of metal materials.

2. GB/T 6394-2017 "General Requirements for Metal Sample Preparation Methods and Surface Defect Evaluation Methods"

This standard specifies the methods for preparing metal samples and the requirements for evaluating surface defects. It is suitable for metal samples manufactured by casting, forging, rolling, cutting, drilling, grinding, or other similar processes.

3. ASTM E112-2018 "Method for Determining Grain Size"

This standard describes the methods used to determine grain size in metal materials, including transmission electron microscopy, high-resolution optical microscopy, and high-energy X-ray diffraction technology.

4. ASTM E408-2018 "Evaluation of directional and multi-directional crystal materials"

This standard specifies the methods used to evaluate the orientation in directional and multi-directional crystal materials. These methods are used to determine the anisotropy or anisotropy of materials in both crystal and mechanical directions.

5. ASTM E562-19 "Evaluating the Size, Distribution, and Quantity of Hard Phases"

This standard specifies the methods for evaluating the size, distribution, and quantity of hard phases in metal materials. This method is applicable to the determination of hard phases, observation of hard phase morphology, and determination of the distribution range of hard phases.

In summary, metallographic analysis is a flexible, universal, and reliable method for analyzing metal materials. By formulating standards and specifications for metallographic analysis and testing, the accuracy and reliability of metallographic analysis can be ensured, and reliable basis can be provided for material design and application. This article hopes to be helpful to you. Our company has a team of professional engineers and industry elites, with three standardized laboratories covering an area of over 1800 square meters. We can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and tape weaving.