Classification and structural characteristics of wire bonding technology

Date：2023-08-30 16:44:00 Views：585

Wire bonding technology is a microelectronic packaging technology used to connect semiconductor chips with wires. In wire bonding technology, metal wires are used to connect the pins of a chip with external leads to achieve the connection between the chip and external circuits. According to different welding methods and structural characteristics, wire bonding technology can be divided into various types.

1. Hot press bonding technology

Hot pressing bonding technology is one of the most common wire bonding technologies. It uses thermal pressure to solder the leads and chip leads together. In this technology, the leads and chip leads are first heated to a high-temperature state through a hot pressing head, and then subjected to a certain amount of pressure to press them together. The structural characteristics of this technology are regular solder joint shape, high solder joint strength, and controllable solder joint size.

2. Solder bonding technology

Solder bonding technology is a technique of soldering leads and chip leads together. In this technology, solder is heated to a liquid state, and then the leads and chip leads are immersed in the solder to melt with the solder and form solder joints. The structural characteristics of this technology are small solder joint size, irregular solder joint shape, and low solder joint strength.

3. Inertial bonding technology

Inertial bonding technology is a technique that utilizes inertial force to weld the leads and chip leads together. In this technology, the leads and chip leads are first heated to a high-temperature state, and then pressed together by inertial force. The structural characteristics of this technology are regular solder joint shape, controllable solder joint size, and high solder joint strength.

4. Laser bonding technology

Laser bonding technology is a technology that uses a laser beam to weld the leads and chip leads together. In this technology, the laser beam is focused on the contact point between the lead and the chip lead, causing it to melt and form solder joints. The structural characteristics of this technology are regular solder joint shape, controllable solder joint size, and high solder joint strength.

Each technology has its advantages and disadvantages, and the most suitable technology needs to be selected based on specific application needs. Chuangxin Testing is a professional testing institution for electronic components. Currently, it mainly provides integrated circuit testing services such as capacitors, resistors, connectors, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, appearance testing of incoming electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, and ROHS composition analysis testing. Welcome to call, we will be happy to serve you!