How to use X-ray to detect the virtual soldering situation of chips? What is its principle?

Date：2024-02-01 11:58:48 Views：277

X-ray detection is a very effective method that can be used to detect the virtual soldering situation of chips. Virtual soldering refers to insufficient contact between solder joints and pads, which may lead to poor electrical connections, signal interference, and other issues. In the process of chip manufacturing, virtual soldering is a common problem, so timely detection and repair are needed.

X-ray detection is a non-invasive detection method that can detect the connection of solder joints without damaging the chip. This method utilizes the characteristics of X-rays and can clearly display the connection of solder joints by scanning and imaging the chip. Specifically, X-ray detection can be carried out through the following steps:

1. Sample preparation: Place the chip sample to be tested in the X-ray detection equipment.

2. Setting parameters: Based on the characteristics of the sample and detection requirements, set the parameters of the X-ray detection equipment, such as voltage, current, exposure time, etc.

3. Start scanning: Start the X-ray detection device and start scanning the chip. During the scanning process, X-rays will pass through the chip and interact with solder joints and pads, forming a projected image.

4. Imaging processing: Process the scanned projection image to generate a clear image of the solder joint connection. These images can be used to analyze the connection of solder joints and detect issues such as virtual soldering.

The principle of X-ray detection is based on the characteristics of X-rays. X-rays are high-energy electromagnetic waves that can penetrate objects and interact with atoms inside them. Different atoms will have different scattering and absorption effects on X-rays, forming different projection images. In chip inspection, X-rays can penetrate the silicon-based substrate and metal layer of the chip, while interacting with solder joints and pads to form clear solder joint connection images.

In summary, X-ray detection is a very effective method that can be used to detect the virtual soldering situation of chips. This method is based on the characteristics of X-rays, and by scanning and imaging the chip, the connection of solder joints can be clearly displayed. Timely X-ray testing during chip manufacturing can help detect and repair solder defects, ensuring the quality and reliability of the chip.