Chuangxin Testing | August Component Testing Abnormal Analysis Report

◆ Report Introduction ◆

In order to make more customers aware of abnormal material information, Chuangxin Testing has released a quality analysis report on component abnormalities to help you warn of risks, ensure safe shopping, and avoid purchasing unqualified components.

This announcement is about the high-risk and high-risk materials intercepted by the laboratory in August 2024.

Partial models

comprehensive analysis

01 Appearance inspection

Appearance inspection refers to confirming whether the received chip quantity, inner packaging, humidity indicator, desiccant requirements, and outer packaging meet the requirements. The appearance inspection of a single chip mainly includes: the typing, year, place of origin, whether it has been recoated, the status of the pins, whether there are re polishing marks, unknown residues, and the position of the manufacturer's logo.

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You can call the national service hotline at 4008-655-800

02 Function testing

Functional testing refers to conducting various necessary logic or signal state tests under specific working conditions (i.e. normal operating environment of the device, usually at room temperature) and in the normal working state of the device. This test is based on the original factory specifications and industry standards or specifications. Feasibility test vectors or dedicated test circuits are designed to apply corresponding signal source inputs to the test samples. Specific conditions such as peripheral circuit adjustment and control, signal amplification or conversion matching are used to analyze the logical relationship of signals and the change status of output waveforms, and to detect the functional characteristics of electronic components.

There are six commonly used methods for chip functional testing, including board level testing, wafer CP testing, packaged finished product FT testing, system level SLT testing, and reliability testing, with multiple approaches taken simultaneously.

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You can call the national service hotline at 4008-655-800

03 Non destructive testing

Non destructive testing refers to the method of inspecting and testing the structure, state, type, quantity, shape, properties, location, size, distribution, and changes of defects inside and on the surface of an IC using physical methods and equipment, without damaging its internal organization.

The commonly used non-destructive testing methods include appearance inspection, X-ray inspection, thermal conductivity testing, acoustic testing, XRF testing, etc.

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You can call the national service hotline at 4008-655-800

04 Open lid inspection

DECAP, also known as open cover testing, is a destructive experiment that uses chemical reagents or laser etching to remove the packaging shell on the outside of the chip, in order to inspect the original factory identification, layout, process defects, etc. on the surface of the internal grains. Open cover testing is a major authenticity testing method that can determine the authenticity and integrity of the chip.

Decap laboratory can handle almost all IC packaging forms (COB, QFP, DIP, SOT, etc.) and wire types (AuCuAg).

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You can call the national service hotline at 4008-655-800

05 Failure Analysis

Through professional failure analysis equipment, various testing and analysis techniques and programs are used to confirm the failure phenomena of electronic components, distinguish their failure modes and mechanisms, determine the final cause of failure, and propose suggestions for improving design and manufacturing processes to prevent the recurrence of failures.

Chuangxin Testing provides component to PCBA analysis and improvement solutions. Common analysis projects include: digital microscope, X-ray testing, ultrasonic scanning (SAT testing), I-V curve testing, lid opening testing, FIB (focused ion beam), Thermal EMMI (InSb), Gallium Indium Arsenide micro optical microscope, laser beam resistance anomaly detection chip delamination (Delayer), cross section testing, scanning electron microscope (SEM)/EDS, etc.

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You can call the national service hotline at 4008-655-800

06DPA detection

Destructive Physical Analysis (DPA), abbreviated as DPA, is a series of inspections and analyses conducted on component samples based on their production batches to verify whether the design, structure, materials, and manufacturing quality of the components meet the intended use or relevant specifications. DPA analysis is not only applicable to military electronic components, but also to civilian electronic components, such as procurement inspection, incoming inspection, and quality monitoring during the production process.

The project is classified and will not be presented in detail