X-ray nondestructive testing technology and its application in integrated circuits

Date：2021-08-13 18:14:00 Views：1753

The structure of electronic devices is becoming more and more fine and smaller. Ng or OK of X-ray fluoroscopy products is essential. The X-ray detector for X-ray fluoroscopy of electronic components is widely used as a precision test equipment in battery, led, SMT, semiconductor, casting, automotive electronics, ceramic products, plastics, connectors and other industries. Xray testing is a non-destructive testing equipment that uses X-rays to penetrate products and scan products. It is of great significance for the detection of abnormal internal structure of products. Now, with the market's attention to product quality, more and more product quality testing instruments have attracted people's attention, such as size measuring instruments, testing instruments, etc.

Xray technology is a mature nondestructive testing method. At present, it has been widely used in the fields of material testing (IQC), failure analysis (FA), quality control (QC), quality assurance and reliability (QA / REL), research and development (R & D). It can detect defects such as delamination and crack of electronic components, led and metal substrate (crack, delamination, hole, etc.), judge whether there are defects in the material, defect shape and size, and determine the defect orientation through image contrast.

Semiconductor packaging refers to welding the connecting wires between semiconductors, resistors, capacitors and other components required to form a functional circuit into a small silicon wafer, and then welding and packaging in the shell. There are many forms, such as round shell type, flat type or dual in-line.

Moore's law is a famous law in the field of chips. The general content is: when the chip price remains unchanged, the number of components on the integrated circuit will double every 18-24 months, and the performance will be improved by 40%. In recent years, the evolution of chip manufacturing technology has continuously verified this law, and the continuous speed has continuously promoted the rapid development of information technology. Moreover, the development of semiconductor packaging and testing field is closely related to the development of the whole semiconductor industry.

Before the chip goes on the market, a series of accurate and complex validity verification processes will be carried out. X-ray is mainly used to detect whether each solder joint on the semiconductor chip is effective. Because the volume of the chip design is getting smaller and smaller, detection equipment with high magnification and resolution is required, and the detection accuracy is very high, so that important welding defects can not be omitted.

In the process of semiconductor packaging testing, the faster the verification speed of the sample, the more it can ensure that its products can be put on the market quickly. After sufficient product quality and yield verification, large-scale outsourcing to large-scale packaging plants and seamless mass production can prevent chip companies from worrying about packaging links, so as to accelerate the development of chip companies.

X-ray nondestructive testing technology has achieved 100% on-line testing, which has become a necessary condition for product quality in the field of semiconductor packaging testing. With the continuous updating of new semiconductor chip technology, X-ray detection technology is also developing towards high precision and intelligence, closely following the new trend and new requirements of semiconductor packaging.

The seamless connection between chip design enterprises and semiconductor packaging and testing plants provides a business model of flexible production capacity, which promotes the growth of a new model in the field of packaging and testing. As a link in the semiconductor packaging industry chain, X-ray nondestructive testing technology is also stepping up technology upgrading to meet the needs of semiconductor chip testing.