How to use X-ray technology to detect the quality of LED chip packaging?

Date：2021-08-31 13:19:00 Views：1537

LED packaging technology is mostly developed and evolved on the basis of discrete device packaging technology, but it has great particularity. With the rapid growth of the application market, it has rapidly expanded the huge market of LED packaging products and spawned tens of thousands of LED packaging enterprises. LED is an electroluminescent semiconductor material chip, which is solidified on the support with silver glue or white glue, then connected with the chip and circuit board with silver wire or gold wire, sealed with epoxy resin around to protect the internal core wire, and finally installed the shell.

LED light bar is widely used in TV, computer, advertising screen and other industries, and its quality has a great impact on the whole relationship chain. Therefore, any small difference in each process will quickly have a direct impact on the quality of LED packaging products. In order to improve the product packaging quality, the chip / packaging quality needs to be tested in each production process link to control the defective and waste products to the minimum.

In order to maintain competitive advantage in the current market environment, LED light strip manufacturers can only keep a firm foothold in the industry by continuously increasing R & D and production capacity and improving product quality. If the waste / defective rate of LED packaging is 0.1%, hundreds of millions of waste / defective products may be generated in the trillion LED packaging products in China every year, resulting in a direct economic loss of nearly 100 million yuan. From the perspective of LED packaging process, the chip may be damaged and all optical and electrical characteristics of LED may be affected in the process of chip expansion, glue preparation and crystal lattice; In the process of solid crystal and pressure welding of the support, there may be chip dislocation, poor contact of the inner electrode, or false welding or welding stress of the outer electrode lead. The chip dislocation affects the distribution and efficiency of the output light field, while the poor contact or false welding of the inner and outer electrodes will increase the contact resistance of the LED; In the process of glue filling and epoxy curing, bubbles and thermal stress may be generated, which will affect the output light effect of LED.

The basic principle of X-ray detection system is that the penetration of X-ray is different from other chemicals. According to the optical principle, if the wire wound fuse in the LED light strip is defective, it will change the attenuation of the object to the ray and cause the change of the ray intensity of the X-ray detection equipment. When the wire wound fuse is stretched or broken, the X-ray intensity of the defective part is higher than that of the non defective part. X-ray detection can penetrate the sample and detect the internal defects of the sample. It is an efficient and fast method for nondestructive detection of internal defects at present.

Therefore, any small difference in each process will quickly have a direct impact on the quality of LED packaging products. In order to improve the product packaging quality, the chip / packaging quality needs to be tested in each production process link to control the defective and waste products to the minimum. Due to the small, fine and complex characteristics of LED chip / device packaging, it is almost difficult to realize the quality detection in packaging by conventional detection methods. However, it is necessary to use X-ray detection technology to observe internal defects without damaging the overall structure of the product.

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