Chip opening detection: IC opening type and precautions

Date：2021-09-26 15:46:00 Views：3633

The purpose of chip opening detection is to expose the internal device chip of the package for further electrical detection and morphology observation of the chip surface. According to the packaging materials and forms, the packaging types of electronic components include glass packaging (diode), metal shell packaging, ceramic packaging, plastic packaging, flip chip packaging, 3D laminated packaging, etc. the lead bonding wires include aluminum wire, gold wire and copper wire.

Types of chip unsealing: chip unsealing is also known as IC de cap. According to the types of unsealing, it includes chemical unsealing, mechanical unsealing, laser unsealing and plasma decap.

The unsealing method needs to be selected according to the packaging form of the chip (including cob, QFP, dip, sot, etc.) and the internal structure of the chip (the bonding wire material is Au Cu Ag). At present, there are many chemical Kaifeng in the market, and the bonding lines inside the chip are gold wires.

Chip cover removal and sealant removal:When analyzing the internal chips, wires and components in the chip failure analysis, due to the blocking observation of the packaging colloid, the combination of "laser etching" and "wet etching" is used to open the cover (decap) and remove the glue (compound removal), so as to expose the coated objects in the package for subsequent experimental treatment and observation.

Package decap led, GaAs chip, vehicle chip, optical coupling chip

Special decap backside, MEMS, fabrication of packaging materials, disassembly of various packages

Chemical etching analysis crater test, removal of welding oil / stain, chemical etching removal of photoresist, pin foot cleaning

Several problems that should be paid attention to when opening the chip / precautions for opening the chip?

(1) The primary problem of chemical unsealing is safety, and safety protection must be paid attention to. It must be operated in a fume hood with an extraction system; Operators must wear protective gloves and glasses; It must be operated in strict accordance with the safety operation procedures of the chemical laboratory.

(2) X-ray scanning can be carried out before opening to determine the chip position and chip size, which is helpful to determine the opening position and select the mold of the packaging opening.

(3) After unsealing, the device shall be cleaned with an ultrasonic cleaner to remove the residue and waste acid remaining on the chip surface. The cleaning solution can be isopropanol or absolute ethanol, and then cleaned with deionized water and dried.

(4) Care should be taken not to expose the bonding wire on the lead frame as much as possible, because the etching acid will react with the coating on the lead frame and may affect the bonding strength.

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