How should the company deal with the failure analysis of electronic components?

Date：2021-09-28 18:13:55 Views：2210

Nowadays, with the continuous improvement of people's requirements for the quality and reliability of electronic products, the reliability of electronic components has attracted people's attention. How to improve reliability has become a hot issue in electronic component manufacturing. For example, the quality reliability of electronic components such as satellites, aircraft, ships and computers is the basis of the quality reliability of satellites, aircraft, ships and computers. These have become the driving force of the reliability development of electronic components, and the failure analysis of electronic components has become a very important part.

The purpose of reliability work is not only to understand and evaluate the reliability level of electronic components, but also to improve the reliability of electronic components. Therefore, after obtaining the fault equipment from the use site or reliability test, it is necessary to carry out various tests, analysis, find and determine the fault causes, feed back the analysis results to the design, manufacturing, management and other relevant departments, and take targeted and effective corrective measures to improve and improve the reliability of the equipment. This kind of test analysis, the process of finding the cause or mechanism of fault, is fault analysis.

Fault analysis is the only way to improve the reliability of electronic components. From design to production to application, components may fail, so failure analysis runs through the whole life cycle of electronic components. Therefore, it is necessary to find out the fault cause, determine the fault mode, and put forward corrective measures to prevent each component from repeating the same fault mode and fault mechanism and improve the reliability of components.

Small and medium-sized enterprises lack the concept of invalid analysis, and the repeated damage of products can not find the source

On the one hand, some small and medium-sized electronic product manufacturers do not have a good material control system and can not effectively trace materials. Once there is a problem, it is difficult to find the channel and source of the year, or even to ensure the authenticity of the materials. What's more, some enterprises do not have the concept of failure analysis and stay in the fire-fighting state of repairing when it is broken, so it is impossible to learn a lesson fundamentally. Some enterprises always damage the chip when using it and think that the chip quality is not good, but they do not fundamentally analyze the cause of the damage and draw a blind conclusion. As a result, it was still bad to change the manufacturer's chip. Many years later, I found that my circuit lacked protection design.

On the other hand, almost all electronic component manufacturers have adopted the attitude of avoiding failed products and international first-line brands. The general process is to provide failure samples first, then fill in the questionnaire, and then send it to the global failure analysis center for queuing analysis. Results failure analysis often takes 1 ~ 2 months. And the reports are often misused by users. For example, electrostatic protection is not good, and wet sensitive devices have popcorn effect. It seems that there has never been the responsibility of electronic component manufacturers. In fact, for many devices, especially some newly launched special chips, there are often many bugs when they first enter the market. These bugs will cause one failure or another. The bugs are covered up by electronic equipment manufacturers.

Moreover, for many small and medium-sized enterprises, if there are many purchase channels, they will often be rejected by the original factory in the first link. Generally speaking, the original factory requires the agent to provide samples of invalid samples. As a result, I checked the batch number and said that I didn't buy the goods and couldn't send samples. Moreover, the original supplier said that if you don't buy my goods, why do I send you samples, which leads to the damage of many small and medium-sized enterprises? I don't understand.

Enterprises should have the ability of failure analysis to prevent and avoid losses in advance

I might say, isn't there a professional failure analysis company? Yes, at present, there are many companies doing fault analysis of electronic components, but the good and bad are intermingled. A common phenomenon is the lack of analysis ability of deep-seated failure mechanism. Many stay on the use of cutting-edge equipment to find fault points. As for why such failures occur, how to avoid them, and whose responsibility is often unable to provide in-depth help.

Therefore, enterprises need to have a certain ability of failure analysis, which is also a problem that needs attention. One is the instrument and the other is the personnel. Advanced failure analysis instruments are often expensive, such as scanning electron microscopy. For ordinary enterprises, they often do not have the strength to be equipped with a full set of instruments and equipment. On the other hand, equipped with these instruments and equipment, high-quality failure analysts are needed to judge the operation, results and mechanism of the instrument. It is difficult for ordinary enterprises to be equipped with complete equipment and expert personnel, which is an embarrassing situation of ineffective analysis.

What should enterprises do about failure analysis?

For the vast majority of enterprises, they also need to cultivate their own failure analysis team according to their own strength. For failure analysis, general enterprises can first be equipped with transistor grapher, and a better domestic product costs 10000 yuan. It is much more convenient to train people in this field on instruments than to spread them out in an all-round way. Moreover, the transistor grapher can basically locate the failed device on the failed pin. If the conditions are good, it can also confirm whether it is electric stress damage or electrostatic damage. Understanding these two points can help developers check the design. If it is electrostatic damage, it can improve the protection conditions for production and use.

For further analysis, a metallographic analysis laboratory needs to be established. The required equipment is: metallographic microscope, stereomicroscope and cutting machine, grinding and polishing machine and sample preparation consumables. If there is such a laboratory, in addition to the surface damage of various parts, it can also observe the internal situation by making slices. Moreover, when the laboratory reaches this level, it can not only be used for fault analysis of components, but also be used to check the faults of welding assembly process, such as welding and the generation of intermetallic compounds. At this time, it can also be used for preliminary certification and destructive physical analysis of components.

At this stage, the investment is relatively large. If a complete set of imported equipment is adopted, the total price shall be at least 600000 ~ 900000 yuan. If domestic equipment is used, the investment can be much less. A full set of domestic equipment is adopted, which can be basically completed within 100000 yuan. At this time, in terms of personnel quality, personnel who understand the material science of electronic components and semiconductor physics are required to carry out relevant work.

As far as integrated circuits are concerned, many faults occur in the bonding system, that is, the connection between pins and integrated circuit chips. The method of metallographic sectioning often destroys the bonding system of the chip. At this time, you can use the unsealing machine to open the plastic material on the surface of the integrated circuit. For many enterprises, this thing is too expensive, often tens of thousands of dollars. Moreover, expensive consumables such as nozzles are often replaced, so many enterprises do not buy this thing at all, but open it manually. However, Kaifeng needs to use strong acids. Some chemicals are still controlled by the state and need to be filed with the Public Security Bureau. Moreover, in the actual implementation, whether it is unsealing machine or manual unsealing, it needs to be carried out in the ventilated kitchen for personal protection. For personnel, in addition to the above knowledge, they should also use highly corrosive chemicals, and in principle, they should have a hazardous chemical operation certificate.

With the help of failure analysis company or university

General enterprises can reach the above level. If the above analysis cannot be finalized, you can go to the social failure analysis company, or go to the university to rent their equipment for analysis. For batch failure identification caused by incoming material problems, the third-party analysis and identification must be carried out in IEC17025 certified laboratory. The report issued by them has legal effect.

In conclusion, the purpose of electronic component fault analysis is to use various test and analysis technologies and analysis procedures to confirm the fault phenomenon of electronic components, distinguish the fault mode and fault mechanism, confirm the final fault cause, put forward suggestions for improving design and manufacturing process, prevent fault repetition and improve component reliability.