Chip testing: reliability test methods and classification of electronic components

Date：2021-10-19 14:55:00 Views：2341

Chip test is generally divided into final test and wafer test from the test object. They refer to the encapsulated chips and the chips that have not been encapsulated. Why is it divided into two paragraphs? In short, because the packaging also has cost, in order to save the cost as much as possible, some tests may be carried out before the chip packaging to eliminate some broken chips. In order to ensure that the factory chips are all OK, the final test, that is, FT test, is the last interception and a necessary link.

1、 If divided by environmental conditions, it can be divided into simulation test and field test under various stress conditions;

2、 Divided by test items, it can be divided into environmental test, life test, accelerated test and various special tests;

3、 If it is divided according to the test purpose, it can be divided into screening test, identification test and acceptance test;

4、 If divided according to the nature of the test, it can also be divided into destructive test and non-destructive test.

The commonly used classification method is to classify reliability tests into five categories:

A. Environmental test B. life test C. screening test D. field service test E. qualification test

What are the classification of reliability environmental test?

In some reliability monographs, the test of placing samples in natural or artificial simulated storage, transportation and working environment is collectively referred to as environmental test. It is to assess the adaptability of products under various environmental conditions (vibration, impact, centrifugation, temperature, thermal shock, hot tide, salt spray, low air pressure, etc.), and it is one of the important test methods to evaluate product reliability. Generally, there are the following types:

1. Stability baking, i.e. high temperature storage test

Test purpose: to assess the impact of high temperature storage on products without applying electrical stress. Products with serious defects are in non-equilibrium state, which is an unstable state. The transition process from non-equilibrium state to equilibrium state is not only the process of inducing the failure of products with serious defects, but also the process of promoting the transition of products from unstable state to stable state.

2. Temperature cycling test

Test purpose: to assess the product's ability to withstand a certain temperature change rate and extreme high temperature and extreme low temperature environment It is set for the thermomechanical properties of the product. When the thermal matching of the materials constituting each part of the product is poor or the internal stress of the part is large, the temperature cycle test can lead to the failure of the product caused by the deterioration of mechanical structure defects. Such as air leakage, internal lead fracture, chip crack, etc.

3. Thermal shock test

Test purpose: to assess the product's ability to withstand severe temperature change, that is, large temperature change rate. The test can lead to the failure of the product caused by the deterioration of mechanical structure defects The purpose of thermal shock test is basically the same as that of temperature cycle test, but the conditions of thermal shock test are much more severe than that of temperature cycle testThe heat capacity is an important factor to ensure the test conditions.

4. Low pressure test

Test purpose: to assess the adaptability of the product to low pressure working environment (such as high-altitude working environment). When the air pressure decreases, the insulation strength of air or insulating materials will weaken; It is easy to produce corona discharge, increase dielectric loss and ionization; The decrease of air pressure will worsen the heat dissipation conditions and increase the temperature of components. These factors will cause the sample to lose the specified function under low air pressure, and sometimes cause permanent damage.

5. Moisture resistance test

Test purpose: To evaluate the decay resistance of microcircuit under humid and hot conditions by applying accelerated stress, which is designed for typical tropical climate environment. The main decay mechanism of microcircuit under wet and hot conditions is the physical process of corrosion caused by chemical process and the increase of microcrack caused by water vapor immersion, condensation and icing. The test also examines the possibility of occurrence or intensification of electrolysis of microcircuit materials under wet and hot conditions. Electrolysis will change the resistance of insulating materials and weaken the ability to resist dielectric breakdown.

6. Salt spray test

Test purpose: To evaluate the corrosion resistance of exposed parts of components and parts under salt fog, humid and hot conditions by accelerated method, which is designed for tropical seaside or marine climate environment The exposed parts of components with poor surface structure will be corroded under salt fog, Hunan humidity and hot conditions.

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