What are the contents of electronic appearance inspection? Application of visual inspection technology

Date：2021-11-18 13:40:24 Views：1699

Semiconductor industry is developing rapidly. Semiconductor packaging is a very important link affecting the development of semiconductor industry. The quality of semiconductor packaging technology is a crucial competitive factor. Whether the electronic components are installed incorrectly or not, whether the connector and battery size are in compliance, etc. The application in the semiconductor industry began very early. Driven by the increasing popularity of large-scale integrated circuits in the semiconductor industry, the demand for output and quality in the industry is increasing sharply. Nowadays, in the field of electronic manufacturing, from capacitors, resistors, connectors and other components to PC boards and hard disks, we can almost see the presence of third-party testing institutions in all links of the electronic manufacturing industry chain.

Application of appearance inspection in semiconductor industry:

1. Application in appearance inspection of small electronic components and small-size industrial products, SMD products and silicon wafers. Detect printing errors, content errors, image errors, direction errors, missing prints and surface defects, and find out defective products.

2. The application of flatness detection in IC chip and electronic connector detects the number of pins and the geometric dimensions of multiple positions of pins, including pitch interval, width, height, curvature and so on.

3. PCB printed circuit inspection, board component position, solder joint, circuit, opening size and angle measurement; Computer micro communication interface and SIM card slot; SMT component placement, surface mounting and surface inspection; SPI solder paste detection, reflow soldering and wave soldering; Detection and measurement of the number of cable connectors, etc.

In the production process of electronic components, many complex processes need to be processed. Under multiple processes, there will be various problems, such as size measurement, surface defects, unclear characters and so on. Due to the wide variety of electronic components, the structural shape, damage degree and inspection methods of various electronic components are also different. Some traditional detection methods can not meet the production needs of high beat and flexibility. Machine vision inspection is a revolutionary technology. It has completely changed the production process of electronic products and improved the flexibility and automation of production. Using this technology, the electronic component manufacturing industry can be efficient and accurate, avoid false detection and false detection caused by manual detection, so as to improve the delivery quality of components and enhance the competitiveness of products.

Machine vision inspection classification:

1. According to the detection function, it can be divided into: positioning, defect detection, counting / omission detection and dimension measurement.

2. According to the carrier installed, it can be divided into online detection system and offline detection system.

3. According to the detection technology, there are usually dimension measurement technology, appearance surface defect detection, OCR technology, etc.

Application cases of machine vision inspection:

1. Visual inspection of battery products: detection of appearance defects such as foreign matters, scratches, indentation, bad polar ear, pollution, corrosion, pits, burn of polar ear, bad code spraying, blurred characters and so on.

2. PCB board visual inspection: PCB board product appearance, size, pin and patch inspection, as well as integrity inspection such as solder joint and direction error.

3. Visual inspection of precision parts: measurement of length, width, height and diameter of precision parts such as screws, bearings and gears, and detection of surface defects such as scratches, scratches, defects and.

4. Visual inspection of electronic components: dimensional measurement of connectors, capacitors, resistors, etc., defects such as pin offset, deformation and shortage, printed character inspection, etc.

5. Visual inspection of food packaging: appearance integrity inspection, bar code identification and sealing inspection of food packaging; Beverage sorting and color selection, liquid detection, production date and shelf life character recognition; Detection of bottle damage and cleanliness above the filling line.

6. Visual inspection of medical packaging: measurement of length, height, diameter and other dimensions of medical plastic bottles and glass bottles, and detection of defects such as damage and black spots.

7. Visual inspection of textile and garment accessories: detection of surface defects of non-woven fabrics, towels and other textiles, such as holes, stains, loose edges, unsealed edges, thread ends, trademarks and other defects, dimension measurement, appearance defect detection and label character detection of textile and garment accessories (such as metal buttons, plastic buttons, etc.).

With the rapid development of China's processing and manufacturing industry, the application demand for electronic appearance inspection is continuously strengthened, which further strengthens the ability of future manufacturing industry in information acquisition and processing. Combined with multi-sensor fusion technology, product quality is guaranteed, manufacturing efficiency is continuously improved, and intelligence is more prominent. In order to adapt to today's rapidly developing society, third-party testing institutions are essential. Chuangxin online testing services include: electronic component testing and verification, IC true and false identification, product design and material selection, failure analysis, function testing, factory incoming material inspection, tape braiding and other testing items. Warmly welcome to call, we will serve you wholeheartedly.