How is the chip tested? X-ray defect detection

Date：2021-11-24 16:12:26 Views：1605

At this stage, the market only cares about whether we can make chips. However, with the maturity of the chip industry, the future focus of the market is bound to be adjusted to whether we can manufacture chips efficiently. Although the market share of testing only accounts for 6% of the whole chip manufacturing industry chain, it is still a very important industry, and even directly related to the quality of chip finished products. A little carelessness will cause incalculable consequences. For a product, the market may pay more attention to its performance at the initial stage of listing, but in the long run, the long-term value of the product is still determined by its quality.

What is chip testing? As the name suggests, chip testing is a link in the process of chip manufacturing in which the testing manufacturer tests the semi-finished chip products in production through professional instruments, so as to improve the yield.

Every chip entering the market must be tested before it can be finally listed. Therefore, the chip testing link actually has a huge market demand. Many biased investors believe that testing is just a routine after chip packaging, but in fact its value is far more than that.

According to the manufacturing process, chip testing can be divided into wafer testing (referred to as intermediate testing) and finished product testing (referred to as finished testing). Their demands are to ensure the improvement of the yield of end products, so as to achieve the purpose of cost control.

Definition of X-ray

X-ray is an electromagnetic wave with a very short wavelength, with a wavelength range of 0.0006-80nm. It has strong penetration and can penetrate various substances with different densities that ordinary visible light cannot penetrate.

X-ray principle

X-ray (hereinafter referred to as X-ray) uses a cathode ray tube to produce high-energy electrons to collide with a metal target. In the process of impact, due to the sudden deceleration of electrons, the lost kinetic energy will be released in the form of X-ray, which has a very short wavelength but high electromagnetic radiation. For the position where the sample cannot be detected by appearance, the contrast effect can be formed by recording the change of light intensity after X-ray penetrates substances with different densities, so as to display the internal structure of the object to be tested, and then observe the problem area inside the object to be tested without damaging the object to be tested.

Application of X-ray ray

1. Purpose of use:

Defect detection of internal cracks and foreign matters in metal materials and parts, plastic materials and parts, electronic components, electronic components and LED components, and analysis of internal displacement of BGA and circuit board; Identify BGA welding defects such as empty welding and false welding, and analyze the internal conditions of microelectronic system and adhesive sealing components, cables, fittings and plastic parts.

2. Application scope:

1) Defect inspection in IC packaging, such as layer peeling, burst, cavity and integrity inspection of wiring;

2) Possible defects in printed circuit board manufacturing process, such as poor alignment or bridging and open circuit;

3) SMT solder joint cavity detection and measurement;

4) Inspection of possible open circuit, short circuit or abnormal connection defects in various connecting lines;

5) Integrity inspection of solder balls in solder ball array packaging and chip cladding packaging;

6) Inspection for cracks in plastic materials or cavities in metal materials with high density;

7) Chip size measurement, line arc measurement, component tin area ratio measurement.

Test steps: confirm the test location and requirements of sample type / material → put the sample into the test bench of X-ray fluoroscopy instrument for X-ray fluoroscopy inspection → image judgment and analysis → mark the defect type and location. However, due to the nature of the material, the equipment will be subject to certain restrictions. For example, aluminum wire or low material density in IC packaging will be penetrated and cannot be inspected.

3. Reference standard

5135z-sx8-t000 welding strength test standard

GJB 548b-2005 test methods and procedures for microelectronic devices

Ipc-a-610e-2010 Chinese version acceptability of electronic components - Part 3

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