Summary of IC chip reliability test items

Date：2021-12-24 11:52:00 Views：2939

Chip reliability test is mainly divided into two major items: environmental test and life test. The environmental test includes mechanical test (vibration test, impact test, centrifugal acceleration test, outgoing line tensile strength test and outgoing line bending test), outgoing line weldability test, temperature test (low temperature, high temperature and temperature alternating test) Damp heat test (constant humidity and alternating damp heat), special test (salt spray test, mold test, low pressure test, electrostatic resistance test, ultra-high vacuum test and nuclear radiation test); The life test includes long-term life test (long-term storage life and long-term working life) and accelerated life test (constant stress accelerated life, step stress accelerated life and sequential stress accelerated life), some of which can be done selectively.

Generally speaking, reliability is the ability of a product to show a specific function in a specific time under standard technical conditions. Reliability is to measure the possibility of failure, the rate of failure, and the maintainability of the product. According to the technical specifications of the products and the requirements of customers, we can perform reliability tests of different specifications such as MIL-STD, JEDEC, IEC, jesd, AEC, andeia, etc.

Reliability test

➢HTOL: high temperature life test(high temperature operating life), also known as burn in

➢Ltol is a low temperature life testIt is basically the same as HTOL, except that the furnace temperature is low. It is generally used to find the failure caused by hot carriers, or to test memory devices or submicron devices

➢EFR / elfr: early failure life test（ Early Failure Rate / Early Life Failure Rate）

➢BLT bias life test（Bias Life Test）

➢Blt-ltst low temperature bias life test（Bias Life Test-Low Temperature Storage Test）

➢Htgb high temperature grid bias test(High Temperature Gate Bias) ，

➢HTRB high temperature reverse bias test(High Temperature Reverse Bias)

Package reliability test items

➢Precon: preprocessing(precondition test), abbreviated as PC, also known as MSL (moisture sensitivity level) moisture absorption sensitivity and humidity sensitivity test: confirm whether the chip sample contains too much water, resulting in chip delamination, crack and popcorn effect during SMT reflow assembly, resulting in short service life or damage, These problems may occur in the process of analog chip sticking to the board.

➢THB: temperature and humidity bias life test(Temperature Humidity Bias Test)

➢H3trb: high temperature and high humidity reverse bias test（High Humidity, High Temperature Reverse Bias）

➢Bhast high accelerated life test(highly accelerated stress test), also known as hast

➢UHAST：(Unbiased HAST)

➢TCT: high and low temperature cycle test(temperature cycling test, also abbreviated as TC, chip level TC)

➢Board level TCT

➢PTC power temperature cycle（Power temperature Cycling）

➢PCT: high pressure cooking test(pressure cook test, also known as AC (autoclave test):

➢TST: high and low temperature impact test(thermal shock test, which can be abbreviated as TS)

➢HTST: high temperature storage test(high temperature storage life test, abbreviated as HTS)

➢Weldability test（Solderability Test ）

➢Welding resistance test（ Solder Heat Resistivity Test ）

➢Appearance inspection(external visual inspection, abbreviated to OM)

➢Push pull test of welding wire（Wire Bond Pull/ Shear）

➢Tin ball thrust test（Solder Ball Shear）

➢Die thrust test（Die Shear Test）

➢Hot drawing test of tin ball（Solder Ball Hot Bump Pull）

➢Tin ball cold drawing test（Solder Ball Cold Bump Pull）

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