What does DPA analysis mean? Knowledge of destructive physical analysis

Date：2022-04-07 15:14:28 Views：2263

DPA analysis (destructive physical analysis) is destructive physical analysis. It is to randomly select appropriate samples from the finished batch of electronic components, and adopt a series of non-destructive and destructive physical test and analysis methods to test whether the design, structure, material and manufacturing quality of components meet the specification requirements of the intended use.

Reject the unqualified batch according to the DPA results and retain the qualified batch. Destructive physical analysis (DPA) is one of the important methods of component quality assurance used in high reliability engineering. It is mainly used for the evaluation of component batch quality, and also suitable for quality monitoring in the production process of components. DPA can find problems that may not be exposed in routine screening inspection. These problems are mainly defects related to product design, structure, assembly and other processes. Due to the technical characteristics of destructive physical analysis technology, DPA for military electronic components can expose the problems in advance and effectively prevent the overall failure of model engineering due to the potential quality problems of electronic components.

For the problems exposed in DPA, as long as the component manufacturer and DPA laboratory closely combine, analyze and track, accurately find out the causes of defects, and take targeted rectification measures, most defect modes can be controlled or eliminated.

Role of DPA destructive physical analysis:

Batch quality consistency inspection

Key process (process) monitoring

Delivery inspection or arrival inspection sampling

Overdue retest sampling

Extension of DPA destructive physical analysis:

Extended to daily inspection or application inspection

Evaluation of authenticity, renovation and fire (water) disaster products

Integrated into device reliability screening, identification and evaluation methods

Quality analysis and comparison

Used to control failure modes related to product design, structure, assembly and other processes

It is used for the production process of electronic components, especially the quality monitoring of key processes and the quality analysis and control of semi-finished products

DPADestructive physical analysis object:

Gjb4027a destructive physical analysis of military electronic components. Gjb40247a-2006 standard includes 16 categories and 49 categories of components, resistors, capacitors, sensitive components and sensors, filters, switches, electrical connectors, relays, coils and transformers, quartz crystals and piezoelectric components, semiconductor discrete devices, integrated circuits, optoelectronic devices, surface acoustic wave devices, RF components, fuses and heaters

DPA destructive physical analysis and test items

1、 Non destructive testing items

The standard defects detected are screening defects, and the defective components can be eliminated through targeted inspection and screening of the whole batch of products.

External visual inspection, X-ray inspection, PIND, sealing, outlet strength, acoustic microscope inspection.

2、 Destructive test items

The standard defects checked out are non screening defects. Whether the defects are batch or not must be carefully analyzed before determining whether the whole batch of devices can be used.

Internal gas composition analysis, internal visual inspection, SEM, bonding strength, shear strength, sample preparation mirror inspection, contact inspection, crimping test, internal inspection, bonding strength and physical inspection.

DPA destructive physical analysis test standard

GJB 40247a-2006 destructive physical analysis method for military electronic components

Mil-std-1580b destructive physical analysis of electronic, electromagnetic and electromechanical components

QJ 1906a-96 destructive physical analysis (DPA) method and program for semiconductor devices

Gjb548b-2005 test methods and procedures for microelectronic devices

Mil-std-883g test methods and procedures for microelectronic devices

GJB 128a-97 test method for semiconductor discrete devices

Mil-std-750d test method for semiconductor discrete devices

Gjb360a-96 test methods for electronic and electrical components

Eia-469-c destructive physical analysis method for highly reliable multilayer ceramic capacitors

Common equipment for DPA destructive physical analysis

Morphology observation, stereomicroscope, metallographic microscope, X-ray transmission system, acoustic scanning microscope, scanning electron microscope, transmission electron microscope, focused ion beam.

Sample preparation equipment:

Mechanical unsealing machine, chemical unsealing machine, reactive ion etching machine, grinding and polishing machine, other testing equipment, particle collision noise tester, helium mass spectrometry leak detector, fluorocarbon coarse leak detector, bonding tension tester, shear force tester, spark tester.

In summary, DPA analysis is generally carried out after the components are inspected, screened and quality consistency inspected to analyze the internal defects. The existence of these defects may lead to the failure or instability of the sample. Therefore, the process of DPA analysis is a process of identifying potential defects and analyzing the hazards of potential defects.