What are the methods for evaluating chip reliability test projects?

Date：2022-05-30 14:38:32 Views：1244

Chip reliability test is mainly divided into two major items: environmental test and life test. The environmental test includes mechanical test (vibration test, impact test, centrifugal acceleration test, outgoing line tensile strength test and outgoing line bending test), outgoing line weldability test, temperature test (low temperature, high temperature and temperature alternating test), damp heat test (constant humidity and alternating damp heat) Special tests (salt spray test, mold test, low pressure test, electrostatic resistance test, ultra-high vacuum test and nuclear radiation test); The life test includes long-term life test (long-term storage life and long-term working life) and accelerated life test (constant stress accelerated life, step stress accelerated life and sequential stress accelerated life), some of which can be selected.

1. What is reliability testing?

The test conducted to evaluate and analyze the reliability of electronic products is called reliability test. For different products, in order to achieve different purposes, different reliability test methods can be selected. Reliability test: also known as product reliability evaluation, it refers to the ability of a product to complete specified functions under specified conditions and within specified time. In the process of design and application, the product is constantly affected by its own and external climatic environment and mechanical environment, but still needs to be able to work normally, so it needs to be verified with test equipment. This verification is basically divided into three parts: R & D test, trial production test and mass production sampling inspection. The reliability test includes: aging test, temperature and humidity test, gas corrosion test, mechanical vibration test, mechanical impact test, collision test and drop test, dust and water proof test, packaging pressure test and other environmental reliability tests.

2. There are many classification methods for reliability test

1. if divided by environmental conditions, it can be divided into simulation test and field test under various stress conditions;

2. divided by test items, it can be divided into environmental test, life test, accelerated test and various special tests;

3. if it is divided according to the test purpose, it can be divided into screening test, identification test and acceptance test;

4. if divided according to the nature of the test, it can also be divided into destructive test and non-destructive test.

5. however, the commonly used classification method is to classify it into five categories: A. environmental test B. life test C. screening test D. field use test E. identification test 1 Environmental test is to assess the adaptability of products under various environmental conditions (vibration, impact, centrifugation, temperature, thermal shock, hot tide, salt spray, low air pressure, etc.), and it is one of the important test methods to evaluate the reliability of products.

3. Reliability test standard

Reliability test

1. Lower temperature limit operation test: the test sample shall be powered on to run the test procedure for preliminary test. Under the condition that the test sample does not work, gradually reduce the temperature in the box to 0 ℃. After the temperature is stable, power on and run the test procedure for 5h. The function and operation of the test sample should be normal. After the test, take out the sample after the box temperature returns to room temperature and recover for 2h under normal atmospheric pressure.

Recommended inspection standard: the function and operation of the tested sample shall be normal without obvious deviation in appearance.

2. Low temperature storage test: put the sample into the low temperature box to reduce the box temperature to -20 ℃, store it for 16h under the condition that the test sample is not working, take out the sample and return to the room temperature, and then restore it for 2h. Power on and run the test procedure for inspection. The function and operation of the test sample should be normal, and there is no obvious deviation in the appearance. In order to prevent the test sample from frosting and condensation during the test, the test sample is allowed to be sealed with polyethylene film before the test. If necessary, the moisture absorbing agent can also be installed in the sealing sleeve.

Recommended inspection standard: the function and operation of the tested sample shall be normal without obvious deviation in appearance.

3. The test sample of the upper temperature working test shall be subject to the preliminary test first. When the test sample is not working, gradually raise the temperature of the box to 40 ℃. After the temperature is stable, power on and run the system diagnostic program for 5h. The function and operation of the test sample should be normal. After the test, when the box temperature returns to room temperature, take out the sample and recover for 2h under normal atmospheric pressure.

Recommended inspection standard: the function and operation of the tested sample shall be normal without obvious deviation in appearance.

4. High temperature storage test put the sample into the high temperature box to raise the box temperature to 55 ℃, store it for 16h under the condition that the test sample is not working, take out the sample and return to room temperature for 2h.

Recommended inspection standard: the function and operation of the tested sample shall be normal without obvious deviation in appearance.

The above is related to the chip reliability test project compiled by the core creation test team. I hope it can help you. Shenzhen Chuangxin Online Testing Technology Co., Ltd. is a well-known professional testing institution for electronic components in China, with 3 standardized laboratories covering an area of more than 1000 square meters. The scope of testing services covers: testing and verification of electronic components, IC authenticity identification, material selection for product design, failure analysis, function testing, factory incoming material inspection, X-ray testing of components and parts, tape braiding and other testing items.