What is the difference between X-rays and ultrasound?

1 Answer

• Both are non-destructive tests. X-ray is used to detect the internal structure and wiring of materials, mainly inspecting the internal wafers, bonding wires, substrates, bonding materials, and plastic packaging materials of chip packaging. At the same time, it can also detect various abnormal phenomena such as wafer cracks, bonding material voids, bonding material climbing height, bonding wire curvature, plastic packaging material foreign objects, module internal component tilting and welding, ESD damage, etc. At the same time, it can detect the consistency between the original sample or good product and the ordinary sample.
  Ultrasonic waves are mainly used to detect delamination, cracking, voids, and adhesion at different interfaces inside the sample packaging. They are often used to detect defects at various interfaces inside the chip packaging (between Die, Lead, Paddle, Sub surfaces and plastic packaging interfaces)

  2024-12-17 17:52:40