What are the steps of ic chip analysis process? Third-party professional testing agency

Date：2023-01-13 11:40:16 Views：740

At present, the requirements for product quality and reliability are increasing, and the work of failure analysis has become more and more important. Through the chip failure analysis, we can find out the defects in integrated circuits, abnormal parameters or improper design and operation. The purpose of failure analysis is to determine the failure mode and failure mechanism, and propose corrective measures to prevent the recurrence of such failure mode or failure mechanism, thus affecting our normal application and production.

Failure mode refers to the failure phenomenon and failure form we observed, such as open circuit, short circuit, bubbling, breakdown, parameter abnormality, function failure, etc.

Main steps and contents of failure analysis

Chip unsealing: remove the IC sealant, while maintaining the integrity of the chip function, and keep die, bond pads, bond wires, and even lead-frame intact, so as to prepare for the next chip failure analysis experiment.

SEM/EDX composition analysis: including material structure analysis/defect observation, conventional micro-area analysis of element composition, accurate measurement of component size, etc. Probe test: use the micro probe to quickly and easily obtain the internal electrical signal of the IC. Laser cutting: use micro-laser beam to cut the specific area on the upper layer of the circuit or chip.

EMMI detection: EMMI low-light microscope is a highly efficient failure analysis tool, providing a highly sensitive and non-destructive fault location method, which can detect and locate very weak luminescence (visible light and near-infrared light), thus capturing the visible light of leakage current generated by various component defects or anomalies.

OBIRCH application (laser beam induced impedance change test): OBIRCH is often used for the analysis of high impedance and low impedance inside the chip, and the analysis of circuit leakage path. The OBIRCH method can effectively locate the defects in the circuit, such as holes in the line and holes under the through hole. The high resistance area at the bottom of the through hole can also effectively detect short circuit or leakage, which is a powerful supplement to the luminescent microscopy technology. LG liquid crystal hot spot detection: use the liquid crystal to sense the molecular arrangement and reorganization at the IC leakage point, and present a mottled image different from other areas under the microscope, to find the leakage area (more than 10mA fault point) that puzzles the designer in the actual analysis. Fixed-point/non-point-point chip grinding: remove the gold bumps planted on the LCD drive chip pad, and keep the pad intact, so as to facilitate subsequent analysis or rebonding.

X-Ray nondestructive detection: detect various defects in the IC package, such as layer peeling, bursting, holes and the integrity of wiring, possible defects in the PCB manufacturing process, such as poor alignment or bridging, open circuit, short circuit or abnormal connection, and the integrity of tin balls in the package.

SAM (SAT) ultrasonic flaw detection: It can carry out non-destructive detection on the internal structure of IC package, effectively detect various damages caused by water vapor or heat energy, such as: o wafer surface delamination, o cracks in the solder ball, wafer or glue filling, o air holes in the packaging material, o various holes such as the holes at the junction surface of the wafer, solder ball, glue filling, etc.

Meaning of failure analysis

Failure analysis is a necessary means to determine the failure mechanism of chips.

Failure analysis provides necessary information for effective failure.

The failure score provides the necessary feedback information for the design engineer to continuously improve or optimize the chip design to make it more consistent with the design specification.

Failure analysis can evaluate the effectiveness of different test vectors, provide necessary supplements for production testing, and provide necessary information basis for the optimization of verification testing process.

In conclusion, failure analysis plays a very important role in the manufacturing, production, research and development, use and other aspects of IC chips. Doing a good job of failure analysis can help product optimization, research and development improvement, and reasonable use, and can also avoid many problems in product update iterations. So today's content will be shared here. If you feel that the content is helpful to you, please pay attention to Chuangxin Testing. We will provide you with more industry information!